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AMD XC2V1500-6BGG575C IC FPGA 392 I/O 575BGA
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DigiKey	XC2V1500-6BGG575C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2V1500-4BGG575I IC FPGA 392 I/O 575BGA
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DigiKey	XC2V1500-4BGG575I	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2V1000-5BGG575C IC FPGA 328 I/O 575BGA
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DigiKey	XC2V1000-5BGG575C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2V1000-4BGG575I IC FPGA 328 I/O 575BGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	XC2V1000-4BGG575I	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now
AMD XC2V1000-4BGG575C IC FPGA 328 I/O 575BGA
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	XC2V1000-4BGG575C	Tray				1 - 10 - 100 - 1000 - 10000 -	Buy Now

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BGG575 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
BGG575 Abstract: No abstract text available Text: 100% Material Declaration Data Sheet BGG575 PK379 v1.1 January 16, 2012 Average Weight: 3.7666 g Component Substance Description CAS# or Description % of Component Use in Product Silicon Die Silicon Die Attach Material Mold Compound 7440-21-3 100.00 Component Weight/	Original	BGG575 PK379 BGG575	PDF
BGG575 Abstract: 575-BALL BG575 Text: R PK044 v1.2.1 March 24, 2005 Molded BGA (BG575/BGG575) Package 575-BALL MOLDED BGA, 1.27MM PITCH (BG575/BGG575) 2004, 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.	Original	PK044 BG575/BGG575) 575-BALL BGG575 BG575	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
datasheet transistor said horizontal tt 2222 Abstract: interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out Text: Virtex-II Platform FPGA User Guide UG002 v2.2 5 November 2007 R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG002 datasheet transistor said horizontal tt 2222 interface of rs232 to UART in VHDL xc9500 80C31 instruction set apple ipad schematic drawing 8 bit alu in vhdl mini project report apple ipad 2 circuit schematic apple ipad Apple iPad 2 panasonic inverter dv 700 manual TT 2222 Horizontal Output Transistor pins out	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
CSG484 Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D	PDF
Lead Free reflow soldering profile BGA Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160 Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160	PDF
XC2V1000 Abstract: XC2V1000 complete datasheet FF1152 DS031-4 v3.4 AF124 XC2V3000 Text: 1 Virtex-II Platform FPGAs: Complete Data Sheet R DS031 v3.4 March 1, 2005 Product Specification Module 1: Introduction and Overview Module 3: DC and Switching Characteristics 7 pages 43 pages • • • • • • • • • • • • Summary of Features	Original	DS031 18-Kb 18-Bit DS031-4 XC2V1000 XC2V1000 complete datasheet FF1152 DS031-4 v3.4 AF124 XC2V3000	PDF
fgg 484 Abstract: FGG676 MAKING A10 BGA R 2.8 no pinout 4 testbench verilog ram 16 x 4 vhdl code for carry select adder using ROM XC2V3000 abe 442 AM3 Processor Functional Data Sheet circuit for conventional inverter for the BGG system Text: 1 Virtex-II Platform FPGAs: Complete Data Sheet R DS031 v3.3 June 24, 2004 Product Specification Module 1: Introduction and Overview Module 3: DC and Switching Characteristics DS031-1 (v3.3) June 24, 2004 7 pages DS031-3 (v3.3) June 24, 2004 42 pages •	Original	DS031 DS031-1 DS031-3 DS031-2 18-Kb 18-Bit DS031-4 fgg 484 FGG676 MAKING A10 BGA R 2.8 no pinout 4 testbench verilog ram 16 x 4 vhdl code for carry select adder using ROM XC2V3000 abe 442 AM3 Processor Functional Data Sheet circuit for conventional inverter for the BGG system	PDF
XILINX/part marking Hot Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160	PDF
XAPP427 Abstract: BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING Text: Application Note: Packaging R Implementation and Solder Reflow Guidelines for Pb-Free Packages XAPP427 v2.2 January 30, 2006 Summary Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of	Original	XAPP427 XAPP427 BFG95 Lead Free reflow soldering profile BGA FSG48 FGG256 FFG1152 FFG896 reflow profile 245 SOG20 BGA PROFILING	PDF
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	UG112 UG072, UG075, XAPP427, BFG95	PDF
FGG676 Abstract: H327 circuit for conventional inverter for the BGG system fgg 484 matrix m21 FF1152 FGG256 wireless encrypt AG244 XC2V3000 Text: 1 Virtex-II Platform FPGAs: Complete Data Sheet R DS031 v3.5 November 5, 2007 Product Specification Module 1: Introduction and Overview Module 3: DC and Switching Characteristics 7 pages 43 pages • • • • • • • • • • • • Summary of Features	Original	DS031 18-Kb 18-Bit DS031-4 FGG676 H327 circuit for conventional inverter for the BGG system fgg 484 matrix m21 FF1152 FGG256 wireless encrypt AG244 XC2V3000	PDF