CAD06W4302 Search Results

CAD06W4302 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 matte tin at solder tail and 1.27-2.54 micronnickel under plated.	Original	UL94V0, CAD06W4302	PDF

Catalog Datasheet

MFG & Type

Document Tags

PDF

Untitled

Abstract: No abstract text available
Text: Amphenol SIM Card Connector 1. Material: Contact: Phosphor Copper Wing: Stainless steel Insulator: Glass filled high temperature Engineering plastics UL94V0, black 2. Finish: Contact: 0.38 micron Min gold plateing at mating area,1.27-2.54 matte tin at solder tail and 1.27-2.54 micronnickel under plated.

Original

UL94V0, CAD06W4302

PDF