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    VTB5050J

    Abstract: VTB5051J 5051j
    Text: 5bE D 3 D 3 D b O cl 0 0 0 1 0 M 2 VTB Process Photodiodes E G 8> 6 521 VCT VTB5050J, 5051J VACTEC PACKAGE DIMENSIONS inch mm PRODUCT DESCRIPTION CASE14A Planarsilicon photodiode in a “flat" win­ dow, three lead TO-5 package. Chip is isolated from the case. The third lead


    OCR Scan     		PDF 3D30b0^ 00010M2 VTB5050J, 5051J CASE14A VTB5050J VTB5051J VTB5050J VTB5051J 5051j

    Untitled

    Abstract: No abstract text available
    Text: 303Db 0T 0 0 0 1 0 4 4 3T4 • VCT SbE D VTB5050UVJ, 1UVJ VTB Process Photodiodes 4 1 -S I E G & 6 VACTEC PACKAGE DIMENSIONS inch mm PRODUCT DESCRIPTION CASE14A Planarsilicon photodiode in a three lead TO-5 package with a UV transmitting "flat" window. Chip is isolated from


    OCR Scan     		PDF 303Db VTB5050UVJ, CASE14A VTB5050UVJ

    VTB5050J

    Abstract: VTB5051J VTB505U 5051J PIR 320 Vactec 25 PIR 148
    Text: BQBQbO'î 0001042 521 « V C T 5bE » VTB Process Photodiodes V T B 5 0 5 0 J , 5 0 51 J E 6 & 6 VACTEC PACKAGE DIMENSIONS inch mm PRODUCT DESCRIPTION CASE14A Planarsilicon photodiode in a “fla f win­ dow, three lead TO-5 package. Chip is isolated from the case. The third lead


    OCR Scan     		PDF VTB5050J, 5051J CASE14A VTB505U VTB5051J 9x1012 8x1013 VTB5050J VTB5051J VTB505U 5051J PIR 320 Vactec 25 PIR 148