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AMD XCV3200E-6CG1156C IC FPGA 804 I/O 1156CBGA
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DigiKey	XCV3200E-6CG1156C	Tray			27	1 - 10 - 100 $4233.15 1000 $4233.15 10000 $4233.15	Buy Now
AMD XCV3200E-7CG1156C IC FPGA 804 I/O 1156CBGA
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DigiKey	XCV3200E-7CG1156C	Tray			27	1 - 10 - 100 $5925.95 1000 $5925.95 10000 $5925.95	Buy Now
AMD Xilinx XC3200E-6CG1156CES
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Bristol Electronics	XC3200E-6CG1156CES		4			1 - 10 - 100 - 1000 - 10000 -	Get Quote

CG1156 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
pk040 Abstract: No abstract text available Text: R Ceramic BGA CG1156 Package PK040 (v1.0) June 1, 2000 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.	Original	PDF	CG1156) PK040 pk040
pk040 Abstract: No abstract text available Text: R Ceramic BGA CG1156 Package PK040 (v1.1) April 6, 2001 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.	Original	PDF	CG1156) PK040 pk040
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
FG676 Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100 Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel	Original	PDF	Q1-02 TQ100 TQ128 TQ144 TQ176 VQ100 FG676 PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
1156-BALL Abstract: bga 896 411PI BF957 132-ball package Text: DataSource CD-ROM Q1-02 Contents Package Drawings Products Guide Product Data Sheets Package Drawings Packaging and Thermal Characteristics Application Notes White Papers Software/Hardware Manuals Xcell Journal Online Xcell Journal Archives Inside Out Columns	Original	PDF	Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package
MS-034-AAn-1 Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002 Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel	Original	PDF	Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
GSR 10,8 Abstract: DLL5 BG432 ic 404 BB112 equivalent Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.0 April 2, 2001 Preliminary Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 Kb to 4 Mb system gates - 130 MHz internal performance (four LUT levels)	Original	PDF	DS022-1 32/64-bit, 66-MHz DS022-1, DS022-3, DS022-2, DS022-4, DS022-4 GSR 10,8 DLL5 BG432 ic 404 BB112 equivalent
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	PDF	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
JEDS51-2 Abstract: xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680 Text: Application Note: Packaging R Packaging Thermal Management XAPP415 v1.0 December 19, 2001 Thermal Management Modern high-speed logic devices consume appreciable amount of electrical energy. This energy invariably turns into heat. Higher device integration drives technologies to produce	Original	PDF	XAPP415 JEDS51-2 xc4010e-pq208 XAPP415 xc4013e-pq240 xc73144bg225 PG223-XC4013E JC JB jt Malico xcv1000efg680
K2466 Abstract: H1342 AU61 Text: 901592 Virtex -E 1.8 V Field Programmable Gate Arrays R DS022 v1.5 July 10, 2000 3* Features Preliminary Product Specification High-performance Built-in Clock Management Circuitry - Eight fully digital Delay-Locked Loops (DLLs) • Fast, High-density 1.8 V FPGA Family	Original	PDF	DS022 32/64-bit, 66-MHz F1156 K2466 H1342 AU61
A21n Abstract: digital dice design VHDL k41 dob Quadrature Decoder Interface ICs Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022 v1.9 February 12, 2001 Preliminary Product Specification Features • • • • High-Performance Built-In Clock Management Circuitry Densities from 58 Kb to 4 Mb system gates - Eight fully digital Delay-Locked Loops (DLLs)	Original	PDF	DS022 32/64-bit, 66-MHz FG860 XCV1000E XCV2000E XCV400E XCV600E A21n digital dice design VHDL k41 dob Quadrature Decoder Interface ICs
K363 equivalent Abstract: n345 AF125 XCV1000E d30122 A281 horizontal driver transistor D155 AY102 j281 pioneer amplifier an214 Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022 v1.7 September 20, 2000 Preliminary Product Specification Features • • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 k to 4 M system gates - 130 MHz internal performance (four LUT levels)	Original	PDF	DS022 32/64-bit, 66-MHz XCV2600E XCV3200E XCV100E" XCV600E" XCV100E XCV1000E, K363 equivalent n345 AF125 XCV1000E d30122 A281 horizontal driver transistor D155 AY102 j281 pioneer amplifier an214
g4aoo Abstract: XCV1000E CG1156 Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.0 April 2, 2001 Preliminary Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 Kb to 4 Mb system gates - 130 MHz internal performance (four LUT levels)	Original	PDF	DS022-1 32/64-bit, 66-MHz DS022-1, DS022-3, DS022-2, DS022-4, DS022-4 g4aoo XCV1000E CG1156

ao21 Abstract: XCV300E-6PQ240C Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022 v1.6 August 1, 2000 Preliminary Product Specification Features • • • - Densities from 58 k to 4 M system gates - 130 MHz internal performance (four LUT levels) - Designed for low-power operation	Original	PDF	DS022 32/64-bit, 66-MHz F1156 ao21 XCV300E-6PQ240C
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	PDF	UG112 UG072, UG075, XAPP427, BFG95
BGA 256 PACKAGE power dissipation Abstract: BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432 Text: Tech Topics Xilinx Fine-Pitch BGA and CSP Packages: The Technological Edge Introduction Rapid evolution of complex electronic systems and the demand for improved functionality at lower cost have resulted in the need for silicon products with smaller footprints. Advanced	Original	PDF	00-mm 27-mm XC9500 BGA 256 PACKAGE power dissipation BGA 64 PACKAGE thermal resistance xilinx CS144 thermal resistance FG676 BG560 BGA and CSP BGA-1156 fine BGA thermal profile cte table flip chip substrate BG432
serial number of internet manager Abstract: 3 bit right left shift register verilog vHDL prog F1156 Text: Virtex -E 1.8 V Field Programmable Gate Arrays R DS022-1 v2.0 April 2, 2001 Preliminary Product Specification Features • • • • • Fast, High-Density 1.8 V FPGA Family - Densities from 58 Kb to 4 Mb system gates - 130 MHz internal performance (four LUT levels)	Original	PDF	DS022-1 32/64-bit, 66-MHz DS022-1, DS022-3, DS022-2, DS022-4, DS022-2 serial number of internet manager 3 bit right left shift register verilog vHDL prog F1156