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    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    dial-up schematic modem board

    Abstract: CH1790 CH1830 CH1832 "eye pattern generator" modem circuit echo CSP96
    Text: CERMETEK MICROELECTRONICS 3ÖE J> B 2005Ô03 OOOllSl 1 H C E R ,T ' 7 S ' 3 3 ^ D CH1790 9600 V.32 Full Range Modem Module INTRODUCTION FEATURES The Cermetek CH1790 V.32 Full Range Modem Module offers the design engineer a quick and easy way of integrating a high


    OCR Scan     		PDF 2D05S03 OQD11S1 CH1790 CH1832 CH1830 475mA; CH1790 dial-up schematic modem board "eye pattern generator" modem circuit echo CSP96