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    Untitled

    Abstract: No abstract text available
    Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101534 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 4 GHZ. 1.1.3 VSWR: 1.25:1 MAX.


    Original     		PDF CT2010ALN MIL-STD-454, IP-1014. MC0023.

    Untitled

    Abstract: No abstract text available
    Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010ALNF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE LEAD FREE PLATING ASSEMBLY DWG: 1101654 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 4 GHZ.


    Original     		PDF CT2010ALNF MIL-STD-454, IP-1014. MC0023. 04-E094

    CT2010ALNF

    Abstract: 1010135 MIL-STD-454 requirement 9
    Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010ALNF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE LEAD FREE PLATING ASSEMBLY DWG: 1101654 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 4 GHZ.


    Original     		PDF CT2010ALNF MIL-STD-454, 824W154. 755W002. 09-E0833 CT2010ALNF 1010135 MIL-STD-454 requirement 9

    CT2010ALN

    Abstract: 1009055 MIL-STD-454
    Text: TITLE: ENGINEERING CONTROL DRAWING. PART IDENTIFIER: CT2010ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101534 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 4 GHZ. 1.1.3 VSWR: 1.25:1 MAX.


    Original     		PDF CT2010ALN MIL-STD-454, 824W154. 755W002. 09-E0833 CT2010ALN 1009055 MIL-STD-454

    tva0300n07

    Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
    Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,


    Original     		PDF

    CT2525ALN

    Abstract: CT3523 CT2010A
    Text: Chips – Standard Terminations EMC’s high power chip terminations are optimized for RF performance. All EMC chips are designed to minimize the variability of capacitive reactance. Localized hot spots associated with trimming have been eliminated. Reduced


    Original     		PDF CT2525 CT3518A* CT2335ALN CT2335 CT3523T* CT3725ALN CT3725TALN* CT3725 CT3737ALN CT3737 CT2525ALN CT3523 CT2010A

    ina 124

    Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
    Text: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz


    OCR Scan     		PDF 42TVA R0300 HR0500 TS0300 TS0300W TS0400 TS0500 TS0500W1 TS0500W TS0500WB1 ina 124 CT2525ALN "beryllium oxide" ct2335 SMT3725ALN SC0066M

    CT2525ALN

    Abstract: CT2010A
    Text: f*TTTS Tedm ohm/ Term inations Chips - Standard EMC's high power chip terminations are optimized fo r RF performance. All EMC chips are designed to minimize the variability o f capacitive reactance. Localized hot spots associated with trimming have been eliminated. Reduced


    OCR Scan     		PDF CT2525 CT3518A* CT2335ALN CT2335 CT3523T* CT3725ALN CT3725TALN* CT3725 CT3737ALN CT3737 CT2525ALN CT2010A

    CT-1005

    Abstract: g 0247 0372
    Text: lin T u l litologi/ Chips - Standard Term inations S election Table Power W Substrate Frequency Max. Avg. (GHz) VSWR Type 2 5 5 10 15 15 15 15 20 20 20 40 50 80 85 100 120 120 150 150 150 250 * BeO Alumina AIN BeO BeO AIN BeO AIN BeO AIN Alumina AIN BeO


    OCR Scan     		PDF CT0402 CT2010A* CT0505ALN CT0505 CT1005 CT1005TALN CT1206 CT1206ALN CT2010 CT2010ALN CT-1005 g 0247 0372