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    DIM1200ESM33F00 Search Results

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    DIM1200ESM33F00 Price and Stock

    Power Integrations 1SP0635D2S1C-DIM1200ESM33-F000

    Gate Drivers Conformal Coded PI Gate Driver Only
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    Mouser Electronics 1SP0635D2S1C-DIM1200ESM33-F000
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    Power Integrations 1SP0635V2M1C-DIM1200ESM33-F000

    Gate Drivers Plug-and-Play Gate Driver, SCALE-2, master, fiber optic interface with versatile link
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics 1SP0635V2M1C-DIM1200ESM33-F000
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    • 10 $402.07
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    Power Integrations 1SP0635D2S1-DIM1200ESM33-F000

    Gate Drivers ONLY for Dynex DIM1200ESM33-F000 module
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    Mouser Electronics 1SP0635D2S1-DIM1200ESM33-F000
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    Power Integrations 1SD536F2-DIM1200ESM33-F000

    Gate Drivers ONLY for Dynex DIM1200ESM33-F000 module
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics 1SD536F2-DIM1200ESM33-F000
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    Power Integrations 1SP0635V2M1-DIM1200ESM33-F000

    Gate Drivers ONLY for Dynex DIM1200ESM33-F000 module
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics 1SP0635V2M1-DIM1200ESM33-F000
    • 1 -
    • 10 $327.46
    • 100 $317.38
    • 1000 $317.38
    • 10000 $317.38
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    DIM1200ESM33F00 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DIM1200ESM33-F000 Linear Integrated Systems IGBT Modules - 3300V Original PDF

    DIM1200ESM33F00 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: DIM1200ESM33-F000 Single Switch IGBT Module DS5831-1.0 JULY. 2005 LN23824 FEATURES • 10µs Short Circuit Withstand • Soft Punch Through Silicon • Isolated MMC Base with AIN Substrates • Lead Free construction • High Thermal Cycling Capability KEY PARAMETERS


    Original
    PDF DIM1200ESM33-F000 DS5831-1 LN23824)

    DIM1200ESM33-F000

    Abstract: No abstract text available
    Text: DIM1200ESM33-F000 Single Switch IGBT Module DS5831-1.0 JULY. 2005 LN23824 FEATURES • 10µs Short Circuit Withstand • Soft Punch Through Silicon • Isolated MMC Base with AIN Substrates • Lead Free construction • High Thermal Cycling Capability KEY PARAMETERS


    Original
    PDF DIM1200ESM33-F000 DS5831-1 LN23824) DIM1200ESM33-F000

    Untitled

    Abstract: No abstract text available
    Text: DIM1200ESM33-F000 DIM1200ESM33-F000 Single Switch IGBT Module PDS5614-3.0 June 2004 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES


    Original
    PDF DIM1200ESM33-F000 PDS5614-3 DIM1200ESM33-F000

    DIM1200ESM33-F000

    Abstract: DIM1200ESM33-F
    Text: DIM1200ESM33-F000 Single Switch IGBT Module Replaces DS5831-2 DS5831-3 May 2011 LN28347 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)


    Original
    PDF DIM1200ESM33-F000 DS5831-2 DS5831-3 LN28347) DIM1200ESM33-F000 DIM1200ESM33-F

    Untitled

    Abstract: No abstract text available
    Text: DIM1200ESM33-F000 DIM1200ESM33-F000 Single Switch IGBT Module PDS55614-1.1 June 2003 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES


    Original
    PDF DIM1200ESM33-F000 PDS55614-1 DIM1200ESM33-F000

    Untitled

    Abstract: No abstract text available
    Text: DIM1200ESM33-F000 DIM1200ESM33-F000 Single Switch IGBT Module PDS5614-2.1 April 2004 FEATURES • Soft Punch Through Silicon ■ 10µs Short Circuit Withstand ■ Isolated MMC Base with AlN Substrates ■ High Thermal Cycling Capability KEY PARAMETERS VCES


    Original
    PDF DIM1200ESM33-F000 PDS5614-2 DIM1200ESM33-F000

    DIM1200ESM33F00

    Abstract: MJ480 DIM1200ESM33-F000
    Text: DIM1200ESM33-F000 Single Switch IGBT Module Replaces DS5831-1.1 FEATURES 10µs Short Circuit Withstand High Thermal Cycling Capability Soft Punch Through Silicon Isolated AlSiC Base with AlN Substrates DS5831-2 March 2010 LN27122 KEY PARAMETERS VCES VCE(sat) * (typ)


    Original
    PDF DIM1200ESM33-F000 DS5831-1 DS5831-2 LN27122) DIM1200ESM33F00 MJ480 DIM1200ESM33-F000

    bi-directional switches IGBT

    Abstract: DIM1200ESM33-F000
    Text: DIM1200ESM33-F000 Single Switch IGBT Module DS5831-1.1 January. 2008 LN25870 FEATURES 10µs Short Circuit Withstand Soft Punch Through Silicon Isolated MMC Base with AIN Substrates Lead Free construction KEY PARAMETERS VCES VCE (sat)* (typ) IC (max) IC(PK)


    Original
    PDF DIM1200ESM33-F000 DS5831-1 LN25870) DIM1200ESM33-F000 bi-directional switches IGBT

    Untitled

    Abstract: No abstract text available
    Text: DIM1200ESM33-F000 Single Switch IGBT Module Replaces DS5831-2 DS5831-3 May 2011 LN28347 FEATURES KEY PARAMETERS • 10µs Short Circuit Withstand  High Thermal Cycling Capability  Soft Punch Through Silicon VCES VCE(sat) * (typ) IC (max) IC(PK) (max)


    Original
    PDF DIM1200ESM33-F000 DS5831-2 DS5831-3 LN28347)