BZT52C33
Abstract: BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C51 25mm2
Text: BZT52C2V4 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes E D A B Mechanical Data · · · · · G Case: SOD-123, Plastic
|
Original
|
PDF
|
BZT52C2V4
BZT52C51
500mW
OD-123,
MIL-STD-202,
25mm2.
300ms.
DS18004
BZT52C33
BZT52C2V7
BZT52C3V0
BZT52C3V3
BZT52C3V6
BZT52C3V9
BZT52C4V3
BZT52C51
25mm2
|
DIODE marking W4 38
Abstract: marking code zener diode wl marking WM Device Marking W4 SOD-123 marking code C15 BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C39 BZT52C3V0
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE Please click here to visit our online spice models database. Features • • • • • • Mechanical Data • • Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
500mW
AEC-Q101
OD-123
J-STD-020D
MIL-STD-202,
DS18004
DIODE marking W4 38
marking code zener diode wl
marking WM
Device Marking W4 SOD-123
marking code C15
BZT52C2V4
BZT52C2V7
BZT52C39
BZT52C3V0
|
BZT52C2V4
Abstract: BZT52C2V7 BZT52C39 BZT52C3V0 BZT52C3V3 BZT52C3V6 J-STD-020A marking code zener diode wl DS18004
Text: BZT52C2V4 - BZT52C39 SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOD-123 · · · · · · · · Maximum Ratings
|
Original
|
PDF
|
BZT52C2V4
BZT52C39
500mW
OD-123
DS18004
BZT52C2V7
BZT52C39
BZT52C3V0
BZT52C3V3
BZT52C3V6
J-STD-020A
marking code zener diode wl
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • • • • • • Mechanical Data • • Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Lead, Halogen and Antimony Free, RoHS Compliant
|
Original
|
PDF
|
BZT52C2V0
BZT52C51
500mW
AEC-Q101
OD123
J-STD-020
MIL-STD-202,
OD123
|
marking W6 zener Diode
Abstract: diode Marking code WT
Text: BZT52C2V4 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C36 BZT52C43 BZT52C47 BZT52C51 BZT52C8V2 BZT52C9V1 Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current
|
Original
|
PDF
|
BZT52C2V4
BZT52C39
BZT52C2V7
BZT52C3V0
BZT52C36
BZT52C43
BZT52C47
BZT52C51
BZT52C8V2
marking W6 zener Diode
diode Marking code WT
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C10 BZT52C13 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C36 BZT52C43 BZT52C47 BZT52C51 BZT52C8V2 BZT52C9V1 Features • · · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
BZT52C10
BZT52C13
BZT52C2V4
BZT52C2V7
BZT52C3V0
BZT52C36
BZT52C43
BZT52C47
|
c2v0
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • • • • • • • Mechanical Data • • Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2
|
Original
|
PDF
|
BZT52C2V0
BZT52C51
500mW
AEC-Q101
OD123
J-STD-020
MIL-STD-202,
OD123
c2v0
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE Please click here to visit our online spice models database. Features • • • • • • Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
500mW
AEC-Q101
OD-123
DS18004
|
marking W6 diode
Abstract: marking code w6
Text: BZT52C2V4 - BZT52C39 SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes SOD-123 · · · · · · · · Maximum Ratings
|
Original
|
PDF
|
BZT52C2V4
BZT52C39
500mW
OD-123
OD-123,
J-STD-020A
MIL-STD-202,
DS18004
marking W6 diode
marking code w6
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V4 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes E D A B Mechanical Data · · · · · G Case: SOD-123, Plastic
|
Original
|
PDF
|
BZT52C2V4
BZT52C51
500mW
OD-123
OD-123,
MIL-STD-202,
DS18004
|
marking code zener diode wl
Abstract: marking WM MARKING w5 BZT52C36 BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C39 BZT52C3V0 BZT52C3V3
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
BZT52C2V4
BZT52C2V7
BZT52C3V0
BZT52C3V3
BZT52C3V6
BZT52C3V9
BZT52C4V3
marking code zener diode wl
marking WM
MARKING w5
BZT52C36
BZT52C39
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C51 SURFACE MOUNT ZENER DIODE Mechanical Data Features • • • • • • • • • Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2
|
Original
|
PDF
|
BZT52C2V0
BZT52C51
500mW
AEC-Q101
OD123
J-STD-020
MIL-STD-202,
DS18004
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • • • • • • • Mechanical Data • • Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Totally Lead-Free & Fully RoHS Compliant Notes 1 & 2
|
Original
|
PDF
|
BZT52C2V0
BZT52C51
500mW
AEC-Q101
OD123
J-STD-020
MIL-STD-202,
OD123
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE Features • • • • • • Mechanical Data • • Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Lead, Halogen and Antimony Free, RoHS Compliant
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
500mW
AEC-Q101
OD-123
J-STD-020D
MIL-STD-202,
DS18004
|
|
wm 294
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE Lead-free SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
BZT52C2V4
BZT52C2V7
BZT52C3V0
BZT52C3V3
BZT52C3V6
BZT52C3V9
BZT52C4V3
wm 294
|
BZT52C6V8
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
BZT52C2V4
BZT52C2V7
BZT52C3V0
BZT52C3V3
BZT52C3V6
BZT52C3V9
BZT52C4V3
BZT52C6V8
|
marking WM
Abstract: BZT52C7v5 spice transistor marking WY BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C39 BZT52C3V0 BZT52C3V3 BZT52C3V6
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
BZT52C2V4
BZT52C2V7
BZT52C3V0
BZT52C3V3
BZT52C3V6
BZT52C3V9
BZT52C4V3
marking WM
BZT52C7v5 spice
transistor marking WY
BZT52C39
|
SOD123 wn diode
Abstract: BZT52C18 BZT52C3V3
Text: BZT52C2V7 - BZT52C51 SURFACE MOUNT ZENER DIODE POWER SEMICONDUCTOR Features • Planar Die Construction 410mW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes · · · E D A B Mechanical Data · ·
|
Original
|
PDF
|
BZT52C2V7
BZT52C51
410mW
OD-123
OD-123,
MIL-STD-202,
01grams
BZT52C18
BZT52C20
BZT52C22
SOD123 wn diode
BZT52C3V3
|
DS18004
Abstract: BZT52C6V8
Text: SPICE MODELS: BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16 BZT52C18 BZT52C20 BZT52C22 BZT52C24 BZT52C27 BZT52C30 BZT52C33 BZT52C36 BZT52C39
|
Original
|
PDF
|
BZT52C2V0
BZT52C2V4
BZT52C2V7
BZT52C3V0
BZT52C3V3
BZT52C3V6
BZT52C3V9
BZT52C4V3
BZT52C4V7
BZT52C5V1
DS18004
BZT52C6V8
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V0 - BZT52C39 SURFACE MOUNT ZENER DIODE Features • • • • • • Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes Lead Free/RoHS Compliant Note 2
|
Original
|
PDF
|
BZT52C2V0
BZT52C39
500mW
AEC-Q101
OD-123
J-STD-020C
MIL-STD-202,
DS18004
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V4 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes E D A B Mechanical Data · · · · · G Case: SOD-123, Plastic
|
Original
|
PDF
|
BZT52C2V4
BZT52C51
500mW
OD-123,
MIL-STD-202,
25mm2.
300ms.
DS18004
|
Untitled
Abstract: No abstract text available
Text: BZT52C2V4 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • · · · Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes E D A B Mechanical Data · · · · · G Case: SOD-123, Plastic
|
Original
|
PDF
|
BZT52C2V4
BZT52C51
500mW
OD-123
OD-123,
MIL-STD-202,
25mm2.
300ms.
DS18004
|
MARKING KWW SOT-23
Abstract: BZT52C18
Text: BZT52C2V7 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • • Planar Die Construction 410m W Power Dissipation on FR-4 PCB • • General Purpose, Medium Current Ideally Suited for Automated Assembly Processes -HEh□ -H A B Mechanical Data_
|
OCR Scan
|
PDF
|
BZT52C2V7
BZT52C51
IL-STD-202,
OD-123
DS18004
MARKING KWW SOT-23
BZT52C18
|
marking code zener diode wl
Abstract: marking WM zener code wn 10 47 l w9 diode cathode marking code 7-7-7-7 zener code wl BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6
Text: BZT52C2V7 - BZT52C51 SURFACE MOUNT ZENER DIODE Features • • • • Planar Die Construction 41 OmW Power Dissipation on FR-4 PCB General Purpose, Medium Current Ideally Suited for Automated Assembly Processes -HEh□ -H A B Mechanical Data_
|
OCR Scan
|
PDF
|
BZT52C2V7
BZT52C51
OD-123,
MIL-STD-202,
BZT52C24
BZT52C27
BZT52C30
BZT52C33
BZT52C36
BZT52C39
marking code zener diode wl
marking WM
zener code wn
10 47 l w9
diode cathode marking code 7-7-7-7
zener code wl
BZT52C3V0
BZT52C3V3
BZT52C3V6
|