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    SOFTENER

    Abstract: DS63 DS5311FP INTEL END OF LIFE 80C196 register file DS5396FP HD6303 nec v40
    Text: D S63« P R O D U C T P R E V IE W DALLAS . DS53xx Micro Softener Chips s e m ic o n d u c to r FEATURES PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed


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    DS53xx DS5340 DS5303 DS2340 DS2301 SOFTENER DS63 DS5311FP INTEL END OF LIFE 80C196 register file DS5396FP HD6303 nec v40 PDF

    register file

    Abstract: INTEL END OF LIFE 80C196 80C196 BOOT HD6301
    Text: DS53xx PRODUCT PREVIEW DALLAS SEMICONDUCTOR FEATURES DS53xx Micro Softener Chips PIN DESCRIPTION • Chips provide softness for microprocessor or microcontroller-based systems • Adapts to task-at-hand: -Converts CMOS SRAM into lithium-backed NV program/data storage


    OCR Scan
    DS53xx -DS5340FP: DS5340 DS5303 DS2340 DS2301 06149Q register file INTEL END OF LIFE 80C196 80C196 BOOT HD6301 PDF