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    texas instruments packing label

    Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
    Text: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make


    Original     		PDF 7150M CDC582 CDC586 CDC2582 CDC2586 SN250056 SN74ACT2235-XX SN74ACT7807-XX SN74ACT7808-XX SN10067 texas instruments packing label SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64

    7434

    Abstract: TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 EN-4085S2
    Text: TEXAS INSTRUMENTS Qualification Notification for the SN74ACT11257, Die Revision A June 14, 1996 Abstract Texas Instruments Advanced System Logic is issuing this notification to qualify the SN74ACT11257, die revision A, to replace the SN74ACT11257, ‘No-Rev’ die revision. The change was to enhance


    Original     		PDF SN74ACT11257, SN74ACT11257 EN-4085S2K3 EMC-300TT ACT11257 7434 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 EN-4085S2

    EN4085S2K3

    Abstract: KMC-188-1 shinetsu Texas Instruments Philippines TNETA1500 TEXAS INSTRUMENTS, Mold EN-4085S2
    Text: TEXAS INSTRUMENTS Qualification Notification for the TNETA1500, Die Revision M May 24, 1996 Abstract Texas Instruments Advanced System Logic is issuing this notification to qualify the TNETA1500, die revision M, to replace the TNETA1500, J die revision. The change was to enhance device


    Original     		PDF TNETA1500, TNETA1500 EN-4085S2K3 KMC-188-1 TNETA1500M EN4085S2K3 KMC-188-1 shinetsu Texas Instruments Philippines TEXAS INSTRUMENTS, Mold EN-4085S2

    F741583

    Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
    Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001


    Original     		PDF EN-4085S2K3 96mils L3/260C UL94-V0 TMS471R1F138 85C/85 3/260C F741583 sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV