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    Intel Corporation EP3C10M164I7N

    IC FPGA 106 I/O 164MBGA
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    DigiKey EP3C10M164I7N Tray 348
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    Altera Corporation EP3C10M164I7N

    FPGA - Field Programmable Gate Array
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    Mouser Electronics EP3C10M164I7N
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    Bristol Electronics EP3C10M164I7N 3
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    EP3C10M164I7N Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    EP3C10M164I7N Altera Embedded - FPGAs (Field Programmable Gate Array), Integrated Circuits (ICs), IC FPGA 106 I/O 164MBGA Original PDF

    EP3C10M164I7N Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    PCN0904

    Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this


    Original     		PDF PCN0904 65-nm 60-nm PCN0904, EU-REP3C16U484I7N EP3C10E144C7 EP3C10E144C7N EP3C10E144C8 PCN0904 EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N

    ADV0907

    Abstract: ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0907 ADDITIONAL ASSEMBLY PLANT FOR MBGA PACKAGES Change Description Altera will be introducing Amkor, Philippines as an additional assembly source for Altera Micro FineLine BGA MBGA packages. This change does not affect the form, fit, or function of the


    Original     		PDF ADV0907 ADV0907 ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N

    CYCLONE 3 ep3c25f324* FPGA

    Abstract: FBGA-484 datasheet EP3C16F484I7N EPM570T144I5 EP3C10E144I7N EP3C25F324I7N EPM1270F256I5 EPM1270T144I5 EP2C5Q208I8N EP3C120F780I7N
    Text: Technical Brief Extended Temperature Support for Cyclone II, Cyclone III, and MAX II Devices Introduction Semiconductor devices undergo at least two types of testing: device characterization and production testing. Device characterization is used to verify the performance of a semiconductor design and its physical implementation.


    Original     		PDF