FBGA-484
Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
Text: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly
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FBGA484
SI-SX32-ACQ256SFG484
SI-SX72-ACQ256SFG484)
SI-SX72-ACQ256SFG484
CQ256
FG484
SI-SX72ACQ256SFG484)
FBGA-484
A54SX32A-CQ256
actel FG484 package mechanical drawing
B22 filament base
land pattern QFP 208
SX72
A54SX32A-FG484
silicone paste p4
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FBGA-484
Abstract: FBGA1152 FBGA896 FBGA676 Actel PQFP208 Actel APA075 import 500k PQFP208 FBGA256 APA150 -TQ1001 datasheet
Text: Application Note AC300 ProASIC to ProASICPLUS® Design Migration Introduction The ProASICPLUS family of FPGAs with FlashLock® combines the advantages of ASICs with the benefits of programmable devices through nonvolatile Flash technology. This enables engineers to create highdensity systems using existing ASIC or FPGA design flows and tools. In addition, the ProASICPLUS family
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AC300
FBGA-484
FBGA1152
FBGA896
FBGA676
Actel PQFP208
Actel APA075
import 500k
PQFP208
FBGA256
APA150 -TQ1001 datasheet
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PDF
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54SX72
Abstract: A54SX32APQ FBGA-484 A54SX16A THERMAL Fuse m20 tf 115 c PAR64 REQ64 A54SX08A A54SX16 A54SX32A
Text: Preliminary v1.1 SX-A Family FPGAs Leading Edge Performance • Configurable I/O Support for 3.3V/5.0V PCI, LVTTL, and TTL • Configurable Weak Resistor Pullup or Pulldown for Tri-Stated Outputs at Power Up • 250 MHz System Performance • 4ns Clock-to-Out Pin-to-Pin
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54SX72
Abstract: FBGA-484 A54SX32APQ208 A54SX16A
Text: Preliminary v1.1 SX-A Family FPGAs Leading Edge Performance • Configurable I/O Support for 3.3V/5.0V PCI, LVTTL, and TTL • Configurable Weak Resistor Pullup or Pulldown for Tri-Stated Outputs at Power Up • 250 MHz System Performance • 4ns Clock-to-Out Pin-to-Pin
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VeriBes24
54SX72
FBGA-484
A54SX32APQ208
A54SX16A
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PDF
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FBGA-484
Abstract: BGA313 reflow soldering profile BGA
Text: Actel provides simple step-by-step assembly flow instructions for attaching QFP and BGA sockets to a PCB. Also included is solder reflow information along with a sample standard reflow temperature profile. Recommended method of attaching QFP prototype sockets to a PCB.
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ADV0505
Abstract: FBGA-484 daewon tray daewon FBGA672 PEAK TRAY bga 1f1-1717-a19 12C-0707-E19 FBGA256 Daewon BGA 7x7
Text: CUSTOMER ADVISORY ADV0505 Adding Daewon shipping tray for BGA and QFP Package Devices Change Description: Altera is adding shipping trays produced by Daewon Semiconductor Packaging Industrial Company as an additional shipping tray for various BGA and QFP packaged devices. The
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ADV0505
and14
12C-0707-E19
12F-1111-119
1F3-1313-D19
1F1-1717-A19
12U-1919-G19
12Y-2323-919
12Y-3333-419
12Y-3535-419
ADV0505
FBGA-484
daewon tray
daewon
FBGA672
PEAK TRAY bga
1f1-1717-a19
12C-0707-E19
FBGA256
Daewon BGA 7x7
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PDF
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A54SX08A
Abstract: FBGA-484 LRD12 A54SX16 A54SX16A A54SX32A A54SX72A PAR64 REQ64 54SX72
Text: Æ ic te ! P r e l i m i n a r y v1 .1 - m SX-AFamily FPGAs L e a d i n g E d g e Pe r f o r m a n e e • Configurable I/O Support for 3.3V5.0VPC3, LVTTL, and TIL • 250 MHz System Performance • Configurable Wfcak Resistor Pullup or Pulldown for
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OCR Scan
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PBGA329
FBGA484
A54SX08A
FBGA-484
LRD12
A54SX16
A54SX16A
A54SX32A
A54SX72A
PAR64
REQ64
54SX72
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