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    FD100H06A5B Search Results

    FD100H06A5B Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    FD100H06A5B International Rectifier Fred Die in Wafer Form Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: Preliminary Data Sheet PD-20201 01/01 FD100H06A5BT Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die


    Original     		PDF PD-20201 FD100H06A5BT S1025 8ETH06 100x100

    FD100H06A5B

    Abstract: FD100H06A5F 8ETH06 FD100H06A5P FD100H06A5R MIL-HDBK-263 S1025
    Text: PD - 20201 rev.C FD100H06A5B FRED Die in Wafer Form z z 600V VF = 2.4 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter


    Original     		PDF FD100H06A5B 220nC 12-Mar-07 FD100H06A5B FD100H06A5F 8ETH06 FD100H06A5P FD100H06A5R MIL-HDBK-263 S1025

    Untitled

    Abstract: No abstract text available
    Text: Preliminary Data Sheet PD-20531 11/00 FD100H06A5BT Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die


    Original     		PDF PD-20531 FD100H06A5BT S1025 100x100

    semitec

    Abstract: 8ETH06 S1025 FD100H06A5B Semitec S1025
    Text: Preliminary Data Sheet PD-20175 01/01 FD100H06A5BT Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die


    Original     		PDF PD-20175 FD100H06A5BT S1025 8ETH06 FD103 100x100 semitec FD100H06A5B Semitec S1025

    FD100H06A5B

    Abstract: PD-20201 8ETH06 S1025
    Text: Preliminary Data Sheet PD-20201 rev. A 06/01 FD100H06A5B Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die


    Original     		PDF PD-20201 FD100H06A5B S1025 8ETH06 100x100 FD100H06A5B