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    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA432: plastic thermal enhanced ball grid array package; 432 balls; heatsink SOT1119-1 B D A D1 ball A1 index area E1 j E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e


    Original     		PDF HBGA432: OT1119-1 sot1119-1 MS-034

    HBGA432

    Abstract: SOT70 IEC 292-1 sot703
    Text: PDF: 2002 Nov 13 Philips Semiconductors Package outline HBGA432: plastic thermal enhanced ball grid array package; 432 balls; body 31 x 31 x 1.42 mm; heatsink A B D SOT703-1 ball A1 index area A A2 A1 E detail X C e1 e ∅v M b e 1/2 ∅w M AD AC AB AA Y W


    Original     		PDF HBGA432: OT703-1 HBGA432 SOT70 IEC 292-1 sot703