HC96526 Search Results

HC96526 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
T6083 Abstract: foxconn motherboard HC96227 8484 au mc 14003 Text: REV. A B ECN. NO. APPD. HC96334 H.T.P. Mr 7 B D '•X.±2P J ± CQ.i-51 i:a±K&&Î i m x± .mi ¡UNITS MM [INCH] mri ■m s« NAME0NTENDED USE STRADDLE MOUNT M CA CDMNJ PART N X(INTENDED USE) EH260S»- APPO: ïiæst mxmss m m u m m m mi <3FW3N HW ?3£&VS0lK WO.	OCR Scan	HC96334 EH260S» L9603 E35G3 T6083 foxconn motherboard HC96227 8484 au mc 14003	PDF
Untitled Abstract: No abstract text available Text: ITEM Q 1TY DESC. 1 HOUSING 2 CONTACT 1 MATERIAL TREATMENT THERMOPLASTIC MEETING UL 94V- 0 MOLDED WHITE COPPER ALLOY PLATIN, 100-200U" TIN /LEAD PLATING O N TAIL CONTACT AREA PLATING REMARK 50-90u" NICKEL BASE SEE REMARK SEE BELOW. REMARK: 1 . PROD. NO.: EH	OCR Scan	50-90u" 100-200U" HC96526 EH29291	PDF

Catalog Datasheet

MFG & Type

Document Tags

PDF

T6083

Abstract: foxconn motherboard HC96227 8484 au mc 14003
Text: REV. A B ECN. NO. APPD. HC96334 H.T.P. Mr 7 B D '•X.±2P J ± CQ.i-51 i:a±K&&Î i m x± .mi ¡UNITS MM [INCH] mri ■m s« NAME0NTENDED USE STRADDLE MOUNT M CA CDMNJ PART N X(INTENDED USE) EH260S»*-* APPO: ïiæst mxmss m m u m m m mi <3FW3N HW ?3£&VS0lK WO.

OCR Scan

HC96334 EH260S» L9603 E35G3 T6083 foxconn motherboard HC96227 8484 au mc 14003

PDF

Untitled

Abstract: No abstract text available
Text: ITEM Q 1TY DESC. 1 HOUSING 2 CONTACT 1 MATERIAL TREATMENT THERMOPLASTIC MEETING UL 94V- 0 MOLDED WHITE COPPER ALLOY PLATIN, 100-200U" TIN /LEAD PLATING O N TAIL CONTACT AREA PLATING REMARK 50-90u" NICKEL BASE SEE REMARK SEE BELOW. REMARK: 1 . PROD. NO.: EH

OCR Scan

50-90u" 100-200U" HC96526 EH29291

PDF