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    sod323 wave soldering

    Abstract: sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820
    Text: Notes on Processing Component Placement HLG0 5414 The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed


    Original     		PDF HLG05510 OT-23 HLG05511 HLG05522 OT-89 HLG05523 HLG05514 OT-143 sod323 wave soldering sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820

    reflow profile 00802

    Abstract: sod323 reflow sod323 wave soldering
    Text: SIEM EN S Notes on Processing Table 1 Solderability Test to Siemens Standard Test criterion Solder bath temperature °C Dwell time in bath s Components for wave and reflow soldering Wetting 215 ± 3 3 ±0.3 Dewetting and leaching 260 ± 5 30 ±1 Components for reflow soldering only


    OCR Scan     		PDF OT-89 OT-143 HLG05515 OT-223 reflow profile 00802 sod323 reflow sod323 wave soldering