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    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN88: plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm A B D SOT906-5 terminal 1 index area E A A1 c detail X e1 Du Ds Dr Dq C e L v w b 23 44 22 M e Es Ej e2 Eh Er Em Eu 1/2 e Ev 66 1


    Original     		PDF HVQFN88: OT906-5

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN88: plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm B D SOT906-1 A terminal 1 index area A E A1 c detail X e1 e 23 1/2 e v w b 44 L M M C C A B C y y1 C 45 22 e Ek e2 Ej Eh 1/2 e 1 terminal 1


    Original     		PDF HVQFN88: OT906-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN88 package SOT906-2 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		PDF HVQFN88 OT906-2 sot906-2