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    Untitled

    Abstract: No abstract text available
    Text: PHOTODIODE Si PIN photodiode S8650 Flat surface ideal for bonding to scintillator S8650 Si PIN photodiode has an epoxy coating window processed to have a flat surface flatness: ±5 µm . When bonded to a scintillator, the flat surface allows highly tight coupling to the scintillator so bubbles are unlikely to penetrate in between.


    Original     		PDF S8650 S8650 SE-171 KPIN1061E02

    Untitled

    Abstract: No abstract text available
    Text: PHOTODIODE Si PIN photodiode S8650 Flat surface ideal for bonding to scintillator S8650 Si PIN photodiode has an epoxy coating window processed to have a flat surface flatness: ±5 µm . When bonded to a scintillator, the flat surface allows highly tight coupling to the scintillator so bubbles are unlikely to penetrate in between.


    Original     		PDF S8650 S8650 SE-171 KPIN1061E02

    scintillator

    Abstract: KPIN1061E02 S8650 SE-171
    Text: PHOTODIODE Si PIN photodiode S8650 Flat surface ideal for bonding to scintillator S8650 Si PIN photodiode has an epoxy coating window processed to have a flat surface flatness: ±5 µm . When bonded to a scintillator, the flat surface allows highly tight coupling to the scintillator so bubbles are unlikely to penetrate in between.


    Original     		PDF S8650 S8650 SE-171 KPIN1061E02 scintillator KPIN1061E02