Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD Call TI SN74LS375D ACTIVE SOIC
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26-Sep-2005
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DR
SN74LS375DRE4
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD Call TI SN74LS375D ACTIVE SOIC
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12-Jan-2006
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DR
SN74LS375DRE4
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 29-Jun-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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29-Jun-2006
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DR
SN74LS375DRE4
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SN74LS375N
Abstract: SN54LS375J SN74LS375D SN74LS375DE4 SN74LS375DG4 SN74LS375DR SN74LS375DRE4 SN74LS375DRG4 SN74LS375J SN74LS375N3
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
SN74LS375N
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
SN74LS375DRE4
SN74LS375DRG4
SN74LS375J
SN74LS375N3
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2013 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) SN54LS375J ACTIVE CDIP J 16 1
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21-Mar-2013
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375J
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SN54LS375J
Abstract: SN74LS375D SN74LS375DE4 SN74LS375DG4 SN74LS375DR SN74LS375DRE4 SN74LS375DRG4 SN74LS375J SN74LS375N SN74LS375N3
Text: PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SN74LS375D ACTIVE SOIC D 16
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15-Oct-2009
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
SN74LS375DRE4
SN74LS375DRG4
SN74LS375J
SN74LS375N
SN74LS375N3
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
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SN74LS375N
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
SN74LS375N
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2012 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish A42 MSL Peak Temp Samples (Requires Login) SN54LS375J ACTIVE CDIP J 16 1 TBD SN74LS375D
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17-Aug-2012
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
Level-1-260C-
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SN54LS375J
Abstract: SN74LS375D SN74LS375DE4 SN74LS375DR SN74LS375DRE4 SN74LS375DRG4 SN74LS375J SN74LS375N SN74LS375N3 SN74LS375NE4
Text: IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
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MS-004
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DR
SN74LS375DRE4
SN74LS375DRG4
SN74LS375J
SN74LS375N
SN74LS375N3
SN74LS375NE4
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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6-Dec-2006
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DR
SN74LS375DRE4
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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4-Jun-2007
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375DR
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 26-Sep-2005 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD Call TI SN74LS375D ACTIVE SOIC
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26-Sep-2005
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DR
SN74LS375DRE4
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SN54LS375
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 28-Aug-2010 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish A42 MSL Peak Temp (3) Samples (Requires Login) SN54LS375J ACTIVE CDIP J 16 1 TBD N / A for Pkg Type
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28-Aug-2010
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DG4
SN74LS375J
SN54LS375
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SN54LS375J
Abstract: SN74LS375D SN74LS375DE4 SN74LS375DR SN74LS375DRE4 SN74LS375J SN74LS375N SN74LS375N3 SN74LS375NE4 SN74LS375NSR
Text: PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD Call TI SN74LS375D ACTIVE SOIC
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12-Jan-2006
SN54LS375J
SN74LS375D
Level-1-260C-UNLIM
SN74LS375DE4
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DR
SN74LS375DRE4
SN74LS375J
SN74LS375N
SN74LS375N3
SN74LS375NE4
SN74LS375NSR
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Untitled
Abstract: No abstract text available
Text: PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status 1 Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) SN54LS375J ACTIVE CDIP J 16 1 TBD A42 SNPB SN74LS375D ACTIVE SOIC
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6-Dec-2006
SN54LS375J
SN74LS375D
SN74LS375DE4
SN74LS375DR
SN74LS375DRE4
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