Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of QFP128 package SOT320-3 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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QFP128
OT320-3
OT320-3
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044H11
Abstract: KT808B 044H10 kt808BM BJG 36 kt808 2s021 B0313 2n1810
Text: POWER SILICON NPN Item Number Part Number I C 5 10 20 SOT7S09 SOT7S09 2N3714 B0245B B0245B B0245B B0313 2S041 ~~~g~ 25 30 ST28143 2SC1115 2SC1115 OTL3203 SOT3207 SOT3207 SOT3207 2N500S ~~~~n 35 40 2N5S24 2N5730 2N4301 2NS128 BOY91 BOS11 GSDB10008 SOT701S
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044H10
KSP1152
KSP1172
OT7A09
OT7S09
2N3714
B0245B
044H11
KT808B
kt808BM
BJG 36
kt808
2s021
B0313
2n1810
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QFP-128
Abstract: QFP128 sot320
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-2 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X
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QFP128:
OT320-2
OT320-2
QFP-128
QFP128
sot320
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MO-112
Abstract: QFP128 INDEX33 sot320
Text: PDF: 2003 Feb 19 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; lead angle 60o SOT320-3 c y X A 96 65 97 64 ZE e A E HE A2 (A 3) A1 θ θ1 wM Lp bp L detail X pin 1 index 33
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QFP128:
OT320-3
MO-112
MO-112
QFP128
INDEX33
sot320
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PDF
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QFP-128
Abstract: 331B-P 97 bp
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.95 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-1 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X
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QFP128:
OT320-1
OT320-1
QFP-128
331B-P
97 bp
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PDF
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MS022
Abstract: QFP128 MS-022
Text: PDF: 2000 Jan 20 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-2 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X
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QFP128:
OT320-2
134E13
MS-022
MS022
QFP128
MS-022
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PDF
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QFP128
Abstract: MS-022
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline QFP128: plastic quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT320-2 c y X A 96 65 97 64 ZE e E HE A A2 A1 (A 3) θ wM Lp bp L pin 1 index detail X
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QFP128:
OT320-2
134E13
MS-022
QFP128
MS-022
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2N2090
Abstract: 2N2095A 2N2022 2N2040 Emihus 2N2020 2n2063 2n2038 2N2082 2N2003
Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 Solitron PPC Product PPC Product Solitron Solitron PPC Product Sid St Dvcs Sid St Dvcs Sid St Dvcs Sid St Dvcs g~:~:g~ ~:~~: ~~: KSP1151 KSP1171 SOT7A07 SOT7A07 SOT7A07 SOT7607 SOT7607 SOn607
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OT85306
OT85506
OT85606
KSP1151
KSP1171
OT7A07
2N2090
2N2095A
2N2022
2N2040
Emihus
2N2020
2n2063
2n2038
2N2082
2N2003
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b0245a
Abstract: b0607 PH3055T FT3055 SOLITRON B0501A MJE280H MJE2801K MJE3055K
Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 2N5877 SOT7732 SOT7732 SOT7732 SOT7742 SOT7742 SOT7742 SOT7762 ~g:gg~~ 35 40 SOT7012 SOT7475 2N2811 OTL8012 SOT3226 SOT3226 SOT3226 SOT85307 SD+;5~01 45 50 55 60 65 70 SOT85507 SOT85607 SOT85607
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B0207
BOW21A
B0501A
OT7618
FT3055
SSP66A
2N6098
2N6099
b0245a
b0607
PH3055T
SOLITRON
MJE280H
MJE2801K
MJE3055K
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TQFP80 footprint dimensions
Abstract: QFP44 footprint STK403-040
Text: This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
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QFP64
TQFP80 footprint dimensions
QFP44 footprint
STK403-040
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PLCC84 package
Abstract: DBS13P DBS17P DIP18 DIP20 HDIP18 LQFP48 LQFP64 LQFP80 PLCC68
Text: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP VSO Soldering nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn nnnn Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL
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DBS13P
OT141-6
DBS17P
OT243-1
OT97-1;
OT97DE
DIP14
OT27-1
DIP16
OT190-1
PLCC84 package
DBS13P
DBS17P
DIP18
DIP20
HDIP18
LQFP48
LQFP64
LQFP80
PLCC68
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SAA4991WP
Abstract: sMD .v05 smd V05 p14 115 SAA4979H itu 656 output converter smd 01c1 80C51 QFP128 SAA4992H
Text: INTEGRATED CIRCUITS DATA SHEET SAA4979H Sample rate converter with embedded high quality dynamic noise reduction and expansion port Product specification 2002 May 28 Philips Semiconductors Product specification Sample rate converter with embedded high quality
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SAA4979H
SCA74
753504/01/pp52
SAA4991WP
sMD .v05
smd V05
p14 115
SAA4979H
itu 656 output converter
smd 01c1
80C51
QFP128
SAA4992H
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B0278
Abstract: b0245 b0663 044H4 1405 Motorola
Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 Solitron PPC Product PPC Product Solitron Solitron PPC Product Sid St Dvcs Sid St Dvcs Sid St Dvcs Sid St Dvcs g~:~:g~ ~:~~: ~~: KSP1151 KSP1171 SOT7A07 SOT7A07 SOT7A07 SOT7607 SOT7607 SOn607
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OT85306
OT85506
OT85606
KSP1151
KSP1171
OT7A07
B0278
b0245
b0663
044H4
1405 Motorola
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SAA5270
Abstract: PTS20 ir detector module vo3 st micro mpeg 2 h 264 hd decoder specification tt 2232 transistor horizontal SAA9042 5 ch audio output ic circuit buffer_8 decoder Ic demultiplexer pts17
Text: INTEGRATED CIRCUITS DATA SHEET SAA7205H MPEG-2 systems demultiplexer Preliminary specification File under Integrated Circuits, IC02 1997 Jan 21 Philips Semiconductors Preliminary specification MPEG-2 systems demultiplexer SAA7205H 7.9 7.10 CONTENTS 1 FEATURES
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SAA7205H
fil31
SCA53
547047/1200/01/pp84
SAA5270
PTS20
ir detector module vo3
st micro mpeg 2 h 264 hd decoder specification
tt 2232 transistor horizontal
SAA9042
5 ch audio output ic circuit
buffer_8
decoder Ic demultiplexer
pts17
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tda120XX
Abstract: sdc 7500 pwm control PHILIPS UOC tv kit service code with data TDA12000H1 tda 8823 equivalent tda 8823 samsung colour tv kit circuit diagram schematic diagram TCON lcd samsung sony x35 lcd smd transistor marking HT1
Text: N U N U N U N U N U C C C C C O O O O O TR O TR O TR O TR LL LL LL LL ED ED ED ED C PY PY PY P O O O O C C C U U U N N O O O C C C Product data sheet N N N Rev. 3.6 — 26 April 2006 O TR N N N N N Versatile signal processor for low- and mid-range TV applications
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-TDA110XX/N1F
-TDA120XX/N1F
UOCIII-TDA110XX-120XX/N1F
tda120XX
sdc 7500 pwm control
PHILIPS UOC tv kit service code with data
TDA12000H1
tda 8823 equivalent
tda 8823
samsung colour tv kit circuit diagram
schematic diagram TCON lcd samsung
sony x35 lcd
smd transistor marking HT1
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KT8278
Abstract: KT827V SK3561 sd333 KT827
Text: POWER SILICON NPN Item Number Part Number I C -5 -10 15 - 20 25 30 ~~~~~~1 2N5039 2N5537 2N5538 S2N5539-8 SML8003 SML8013 SML8016 SML8071 SPC163-08 163-08A 163-08SPC 163-08 163-08 2N5303 807458 807458 ~¥~:~: 35 40 STC1726 2N4211 SOT8013 SOT8013 SOT8013 SOT8157
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2N1824
2N2124
2N2740
2N2746
6000n
6000n
KT8278
KT827V
SK3561
sd333
KT827
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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