Untitled
Abstract: No abstract text available
Text: Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 e ZD w M bp v M A D B HD v M B 5 10 mm scale DIMENSIONS (mm are the original dimensions)
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TQFP100:
OT386-1
137E20
MS-026
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP100 package SOT386-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land
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TQFP100
OT386-1
OT386-1
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sot386
Abstract: MA26
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD
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TQFP100:
OT386-1
OT386-1
sot386
MA26
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TQFP100
Abstract: tQFP100 package MS-026 MS-026 tqfp100
Text: PDF: 2000 Feb 02 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD
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TQFP100:
OT386-1
137E20
MS-026
TQFP100
tQFP100 package
MS-026
MS-026 tqfp100
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MS-026
Abstract: 137e20 TQFP100 MS-026 tqfp100
Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm SOT386-1 c y X A 51 75 50 76 ZE e E HE A A2 w M A 3 A1 θ bp Lp pin 1 index L 100 detail X 26 1 25 ZD e v M A w M bp D B HD v M B
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TQFP100:
OT386-1
137E20
MS-026
MS-026
137e20
TQFP100
MS-026 tqfp100
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TQFP100
Abstract: TQFP-100
Text: Philips Semiconductors Package outlines TQFP100: plastic thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm 1997 Aug 04 639 SOT386-1
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TQFP100:
OT386-1
TQFP100
TQFP-100
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pz5064c
Abstract: PZ5064C10BC PZ5064C7A44 PZ5064C7BC PZ5064N10A44 PZ5064N10BC PZ5064N12A44 PZ5064N12BC PZ5064C10A44
Text: INTEGRATED CIRCUITS PZ5064C/PZ5064N 64 macrocell CPLD with enhanced clocking Preliminary specification Supersedes data of 1998 May 05 IC27 Data Handbook Philips Semiconductors 1998 Jul 21 Philips Semiconductors Preliminary specification 64 macrocell CPLD with enhanced clocking
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PZ5064C/PZ5064N
PZ5064C/PZ5064N
50MHz
pz5064c
PZ5064C10BC
PZ5064C7A44
PZ5064C7BC
PZ5064N10A44
PZ5064N10BC
PZ5064N12A44
PZ5064N12BC
PZ5064C10A44
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LQFP64. footprint
Abstract: dual infrared transistor TQFP80 footprint QFP package weight diode databook package outline SMD Packages TQFP100 footprint LQFP32 LQFP48 LQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
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QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
QFP160
OT322-1)
LQFP64. footprint
dual infrared transistor
TQFP80 footprint
QFP package weight
diode databook package outline
SMD Packages
TQFP100 footprint
LQFP32
LQFP48
LQFP64
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PZ3128
Abstract: PZ3128IS12A84 PZ3128IS15A84 PZ3128-S12A84 PZ3128-S12BB1 PZ3128-S15A84 PZ5128 OH12 OG5 109
Text: INTEGRATED CIRCUITS PZ3128 128 macrocell CPLD Product specification Supersedes data of 1997 Apr 28 IC27 Data Handbook Philips Semiconductors 1997 Aug 12 Philips Semiconductors Product specification 128 macrocell CPLD PZ3128 FEATURES Table 1. PZ3128 Features
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PZ3128
PZ3128
PZ3128IS12A84
PZ3128IS15A84
PZ3128-S12A84
PZ3128-S12BB1
PZ3128-S15A84
PZ5128
OH12
OG5 109
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TQFP100 footprint
Abstract: SMD codes databook LQFP32 LQFP48 LQFP64 LQFP80 QFP100 QFP160 QFP52 SSOP16
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave
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SSOP16
OT369-1)
SSOP20
OT266-1)
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2
OT382-1)
TQFP100 footprint
SMD codes databook
LQFP32
LQFP48
LQFP64
LQFP80
QFP100
QFP160
QFP52
SSOP16
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS NOTICE: SEE ATTACHED ERRATA WHICH FOLLOWS THIS DOCUMENT FOR INFORMATION REGARDING CHANGED SPECIFICATIONS PDI1394L21 1394 full duplex AV link layer controller Preliminary specification Supersedes data of 1998 Dec 16 Philips Semiconductors
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PDI1394L21
PDI1394L21
IEC61883
PDI1394L21,
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR5064C 64 macrocell CPLD with enhanced clocking Preliminary specification Supersedes data of 1998 May 05
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XCR5064C
XCR5064C
PZ5064C/PZ5064N
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XCR3128A
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR3128A 128 macrocell CPLD with enhanced clocking Preliminary specification IC27 Data Handbook
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XCR3128A
PZ3128A/PZ3128D
XCR3128A
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TQFP80 footprint dimensions
Abstract: QFP44 footprint STK403-040
Text: This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
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QFP64
TQFP80 footprint dimensions
QFP44 footprint
STK403-040
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TQFP80 footprint
Abstract: TQFP100 footprint QFP160 diode databook package outline SMD CODE databook SMD Packages TQFP80 package LQFP32 LQFP48 LQFP64
Text: Philips Semiconductors Package information Soldering INTRODUCTION SURFACE MOUNTED PACKAGES There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is
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SSOP16
OT369-1)
SSOP20
OT266-1)
QFP52
OT379-1)
QFP100
OT317-1,
OT317-2,
OT382-1)
TQFP80 footprint
TQFP100 footprint
QFP160
diode databook package outline
SMD CODE databook
SMD Packages
TQFP80 package
LQFP32
LQFP48
LQFP64
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS m m s ^ e eI It Xiiinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family, For more technical or sales information, please see: www.xilinx.com XCR5128 128 macrocell CPLD Product specification Supersedes data of 1997 Aug 12
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XCR5128
PZ5128
PZ5128
OT322-2
M0112DD1
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS im m l y i E I TI Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family, For more technical or sales information, please see: www, xilin i* com XCR3128 128 macrocell CPLD Product specification Supersedes data of 1997 Aug 12
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XCR3128
PZ3128
PZ3128
OT322-2
M0112DD1
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PZ5128CS7
Abstract: No abstract text available
Text: Philips Sem iconductors Product specification 128 macrocell CPLD with enhanced clocking PZ5128C/PZ5128N FEATURES DESCRIPTION • Industry’s first TotalCMOS PLD - both CM OS design and process technologies The PZ5128C/PZ5128N CPLD Com plex Program mable Logic
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PZ5128C/PZ5128N
OT425-1
PZ5128CS7
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Untitled
Abstract: No abstract text available
Text: Product specification Philips Semiconductors 128 macrocell CPLD with enhanced clocking PZ5128C/PZ5128N FEATURES DESCRIPTION • Industry’s first TotalCMOS PLD - both CMOS design and process technologies The PZ5128C/PZ5128N CPLD Complex Programmable Logic
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PZ5128C/PZ5128N
100jiA
50MHz
Mil-Std-883C
19951C
100-pin
128-pin
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Preliminary specification 64 macrocell CPLO with enhanced clocking FEATURES PZ3064A/PZ3064D Table 1. PZ3064A/PZ3064D Features • Industry’s first TotalCMOS PLD - both CMOS design and process technologies PZ3064A/PZ3064D Usable gates
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PZ3064A/PZ3064D
50MHz
l/Os48
I/0-C10
I/0-C11
I/0-C12
I/0-C13
IZO-C15
I/0-D15
I/0-D13
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PZ5064CS10
Abstract: PZ5064CS10BC PZ5064CS10A44 PZ5064CS7BC PZ5064CS7A44 PZ5064CS7BP PZ5064NS10A44 PZ5064NS10BC PZ5064NS12A44 PZ5064NS12BC
Text: INTEGRATED CIRCUITS Xifinx has acquired the entire Philips CoolRunoer 8 £«& ^S g X«i5c ft « »0» »g »0» Low Power CPLD Product Family, For more technical or sales information^ please see; www.xilinx.com l XCR5064C 64 macrocell CPLD with enhanced clocking
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22v10 pal
Abstract: pal 002 PZ3128 PZ3128-S12A84 PZ3128-S12BB1 PZ3128-S12BP PZ3128-S15A84 PZ3128-S15BB1 PZ3128-S15BP PZ5128
Text: Philips Sem iconductors Product specification 128 macrocell CPLD PZ3128 Table 1. PZ3128 Features FEATURES • Industry’s first TotalCMOS PLD - both CMOS design and process technologies PZ3128 Usable gates • Fast Zero Power FZP™ design technique provides ultra-low
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OT322-2
M0112DD1
22v10 pal
pal 002
PZ3128
PZ3128-S12A84
PZ3128-S12BB1
PZ3128-S12BP
PZ3128-S15A84
PZ3128-S15BB1
PZ3128-S15BP
PZ5128
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JEDEC B12-43
Abstract: pal 002 PZ3128 PZ5128 PZ5128IS15A84 PZ5128-S10A84 PZ5128-S10BB1 PZ5128-S12A84 PZ5128-S12BB1 PZ5128-S7A84
Text: Philips Sem iconductors Product specification 128 macrocell CPLD PZ5128 Table 1. PZ5128 Features FEATURES • Industry’s first TotalCMOS PLD - both CMOS design and process technologies PZ5128 Usable gates • Fast Zero Power FZP™ design technique provides ultra-low
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OT322-2
M0112DD1
JEDEC B12-43
pal 002
PZ3128
PZ5128
PZ5128IS15A84
PZ5128-S10A84
PZ5128-S10BB1
PZ5128-S12A84
PZ5128-S12BB1
PZ5128-S7A84
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philips sq8
Abstract: QPP80
Text: Philips Semiconductors Package information Soldering SURFACE MOUNTED PACKAGES INTRODUCTION There is no soldering method that is ideal for all 1C packages. Wave soldering is often preferred when though-hole and surface mounted components are mixed on one printed-circuit board. However, wave
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MO-15QAH
OT341-1
philips sq8
QPP80
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