SOT464 Search Results

SOT464 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT464-1		NXP Semiconductors	Plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm		Original	PDF
SOT464-2		NXP Semiconductors	Plastic thermal enhanced shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm; heatsink		Original	PDF

SOT464 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Package outline HSQFP240: plastic thermal enhanced shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm; heatsink SOT464-2 c y X A Dh 121 120 180 181 ZE e E HE Eh A A2 A1 A3 wM θ bp Lp L pin 1 index detail X 240 61 60 1 ZD wM bp e v M A D B HD v M B	Original	HSQFP240: OT464-2	PDF
Untitled Abstract: No abstract text available Text: Package outline HSQFP240: plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm SOT464-1 c y X 180 121 120 181 e E HE A A2 A1 A 3 θ wM Lp bp L detail X pin 1 index 61 240 1 e 60 wM bp D HD 5 10 mm scale DIMENSIONS (mm are the original dimensions)	Original	HSQFP240: OT464-1	PDF
dh 321 Abstract: No abstract text available Text: PDF: 2002 Jun 19 Philips Semiconductors Package outline HSQFP240: plastic thermal enhanced shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm; heatsink SOT464-2 c y X A Dh 121 120 180 181 ZE e E HE Eh A A2 A1 A3 wM θ bp Lp L pin 1 index detail X	Original	HSQFP240: OT464-2 dh 321	PDF
sot464 Abstract: wm60 Text: PDF: 1999 Nov 12 Philips Semiconductors Package outline HSQFP240: plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm SOT464-2 c y X 180 121 120 181 e K E HE A A2 A1 θ wM Lp bp L pin 1 index detail X 61 240 1 60 wM bp e J D HD 5 10 mm	Original	HSQFP240: OT464-2 OT464-2 sot464 wm60	PDF
sot464 Abstract: No abstract text available Text: PDF: 1999 Nov 12 Philips Semiconductors Package outline HSQFP240: plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm SOT464-1 c y X 180 121 120 181 e E HE A A2 A1 A 3 θ wM Lp bp L detail X pin 1 index 61 240 1 60 wM bp e D HD 5	Original	HSQFP240: OT464-1 OT464-1 sot464	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package	PDF