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Nexperia 74LVC2G08DC-Q100H Logic Gates 74LVC2G08DC-Q100/SOT765/VSSOP8
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	74LVC2G08DC-Q100H	Reel	774,000		3,000	1 - 10 - 100 - 1000 - 10000 $0.153	Buy Now
Nexperia 74LVC2G125DC,125 Buffers & Line Drivers SOT765-1 BUFFERS & LINE DVRS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	74LVC2G125DC,125	Reel	45,000		3,000	1 - 10 - 100 - 1000 - 10000 $0.12	Buy Now
Nexperia 74LVC2T45DC,125 Bus Transceivers SOT765-1 BUS TRANSCEIVERS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	74LVC2T45DC,125	Reel	42,000		3,000	1 - 10 - 100 - 1000 - 10000 $0.202	Buy Now
Nexperia 74AHC123ABQ,115 Monostable Multivibrator SOT763-1 MONOSTABLE MULTIVIB
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	74AHC123ABQ,115	Reel	39,000		3,000	1 - 10 - 100 - 1000 - 10000 $0.115	Buy Now
Nexperia 74HC4051BQ,115 Multiplexer Switch ICs MULTIPLEXER SWITCH ICS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TTI	74HC4051BQ,115	Reel	30,000		3,000	1 - 10 - 100 - 1000 - 10000 $0.122	Buy Now

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SOT76 Datasheets (13)

Part	Manufacturer	Description	Datasheet Type	PDF
SOT761-1	NXP Semiconductors	Footprint for reflow soldering SOT761-1	Original	PDF
SOT761-1	NXP Semiconductors	Plastic thin fine-pitch ball grid array package; 72 balls; body 6 x 6 x 0.8 mm	Original	PDF
SOT762-1	NXP Semiconductors	Plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm	Original	PDF
SOT762-1	NXP Semiconductors	Footprint for reflow soldering SOT762-1	Original	PDF
SOT762-1_115	NXP Semiconductors	Standard product orientation 12NC ending 115	Original	PDF
SOT763-1	NXP Semiconductors	Plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm	Original	PDF
SOT763-1_115	NXP Semiconductors	DHVQFN24; Reel pack; SMD, 7"Q1/T1 Standard product orientationOrderable part number ending ,115 or XOrdering code (12NC) ending 115	Original	PDF
SOT764-1	NXP Semiconductors	Plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm	Original	PDF
SOT764-1_115	NXP Semiconductors	DHVQFN20; Reel pack; SMD, 7"Q1/T1 Standard product orientationOrderable part number ending ,115 or XOrdering code (12NC) ending 115	Original	PDF
SOT765-1	Philips Semiconductors	plastic very thin shrink small outline package 8 leads body width 2.3 mm	Original	PDF
SOT765-1_125	NXP Semiconductors	VSSOP8; Reel pack, reverse; SMD, 7"Q3/T4 Standard product orientationOrderable part number ending ,125 or HOrdering code (12NC) ending 125	Original	PDF
SOT766-1	NXP Semiconductors	Plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad	Original	PDF
SOT766-2	NXP Semiconductors	Plastic thermal enhanced low profile quad flat package; 176 leads	Original	PDF

SOT76 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: SOT762-1 Standard product orientation 12NC ending 115 Rev. 03 — 28 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT762-1 115 180 x 12	Original	OT762-1 OT762-1	PDF
Untitled Abstract: No abstract text available Text: Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad SOT766-1 c y exposed die pad X Dh A 132 133 89 88 ZE e Eh E HE A A2 A1 A 3 θ wM Lp L bp detail X pin 1 index 176 45 1 44	Original	HLQFP176: OT766-1 MS-026	PDF
Untitled Abstract: No abstract text available Text: Package outline DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A E A1 c detail X terminal 1 index area terminal 1 index area C e1 e 2 7 y y1 C v M C A B	Original	DHVQFN16: OT763-1 MO-241	PDF
2N2090 Abstract: 2N2095A 2N2022 2N2040 Emihus 2N2020 2n2063 2n2038 2N2082 2N2003 Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 Solitron PPC Product PPC Product Solitron Solitron PPC Product Sid St Dvcs Sid St Dvcs Sid St Dvcs Sid St Dvcs g~:~:g~ ~:~~: ~~: KSP1151 KSP1171 SOT7A07 SOT7A07 SOT7A07 SOT7607 SOT7607 SOn607	Original	OT85306 OT85506 OT85606 KSP1151 KSP1171 OT7A07 2N2090 2N2095A 2N2022 2N2040 Emihus 2N2020 2n2063 2n2038 2N2082 2N2003	PDF
DBS27P Abstract: DBS27 sot767 Text: PDF: 2002 May 06 Philips Semiconductors Package outline DBS27P: plastic DIL-bent-SIL special bent power package; 27 leads (lead length 7.7 mm) SOT767-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z e 5 v M e2	Original	DBS27P: OT767-1 DBS27P DBS27 sot767	PDF
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT761-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	TFBGA72 OT761-1 OT761-1	PDF
Untitled Abstract: No abstract text available Text: 16 FN VQ DH SOT763-1 DHVQFN24; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering code 12NC ending 115 Rev. 1 — 4 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape	Original	OT763-1 DHVQFN24; 001aak603 OT763-1	PDF
Untitled Abstract: No abstract text available Text: Package outline VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index A3 θ Lp 1 4 e L detail X w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT	Original	OT765-1 MO-187	PDF
HEF4052B-Q100 Abstract: 74AHC1G09-Q100 NPIC6C596-Q100 NPIC6C595-Q100 Text: Automotive Innovative package options Suffix BQ PW D PW BQ PW GW GM SOT763-1 SOT403-1 SOT108-1 SOT402-1 SOT764-1 SOT360-1 SOT363 SOT886 16-pin 16-pin 14-pin 14-pin 20-pin 20-pin 6-pin 6-pin Width mm 2.50 6.40 6.00 6.40 2.50 6.40 2.10 1.00 Length (mm) 3.50	Original	OT763-1 OT403-1 OT108-1 OT402-1 OT764-1 OT360-1 OT363 OT886 16-pin HEF4052B-Q100 74AHC1G09-Q100 NPIC6C596-Q100 NPIC6C595-Q100	PDF
dhvqfn14 Abstract: MO-241 sot762 SOT762-1 Text: PDF: 2003 Jan 28 Philips Semiconductors Package outline DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1	Original	DHVQFN14: OT762-1 MO-241 dhvqfn14 MO-241 sot762 SOT762-1	PDF
DHVQFN-20 Abstract: SOT764-1 MO-241 DHVQFN20 sot764 Text: PDF: 2003 Jan 28 Philips Semiconductors Package outline DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1	Original	DHVQFN20: OT764-1 05ail MO-241 DHVQFN-20 SOT764-1 MO-241 DHVQFN20 sot764	PDF
Untitled Abstract: No abstract text available Text: Package outline DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A E A1 c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B	Original	DHVQFN20: OT764-1 protrusions75 MO-241	PDF
SOT762-1 Abstract: sot762 Text: SOT762-1 Standard product orientation 12NC ending 115 Rev. 01 — 13 February 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT762-1 115	Original	OT762-1 OT762-1 SOT762-1 sot762	PDF
SOT764-1 Abstract: NXP 12NC ending Text: SOT764-1 Standard product orientation 12NC ending 115 Rev. 01 — 23 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT764-1 115	Original	OT764-1 OT764-1 SOT764-1 NXP 12NC ending	PDF

Untitled Abstract: No abstract text available Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of DHVQFN14 package SOT762-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout	Original	DHVQFN14 OT762-1 OT762-1	PDF
HQFP128 Abstract: ZD 103 sot760 Text: PDF: 2002 Jun 14 Philips Semiconductors Package outline HQFP128: plastic thermal enhanced quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; heatsink SOT760-1 c y X Dh A 96 65 ZE 64 97 e E HE Eh A A2 A1 (A3) θ wM Lp bp L detail X pin 1 index	Original	HQFP128: OT760-1 HQFP128 ZD 103 sot760	PDF
DHVQFN16 Abstract: SOT763-1 SOT-763 MO-241 Diode Y1 sot763 Text: PDF: 2003 Jan 28 Philips Semiconductors Package outline DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1	Original	DHVQFN16: OT763-1 05ail MO-241 DHVQFN16 SOT763-1 SOT-763 MO-241 Diode Y1 sot763	PDF
B0278 Abstract: b0245 b0663 044H4 1405 Motorola Text: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 Solitron PPC Product PPC Product Solitron Solitron PPC Product Sid St Dvcs Sid St Dvcs Sid St Dvcs Sid St Dvcs g~:~:g~ ~:~~: ~~: KSP1151 KSP1171 SOT7A07 SOT7A07 SOT7A07 SOT7607 SOT7607 SOn607	Original	OT85306 OT85506 OT85606 KSP1151 KSP1171 OT7A07 B0278 b0245 b0663 044H4 1405 Motorola	PDF
SOT765-1 Abstract: No abstract text available Text: SOT765-1 Reversed product orientation 12NC ending 125 Rev. 02 — 24 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT765-1 125	Original	OT765-1 OT765-1 SOT765-1	PDF
HLQFP176 Abstract: MS-026 sot766 Text: PDF: 2002 Jun 13 Philips Semiconductors Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad SOT766-1 c y exposed die pad X Dh A 132 133 89 88 ZE e Eh E HE A A2 A1 A 3 θ wM Lp	Original	HLQFP176: OT766-1 MS-026 HLQFP176 MS-026 sot766	PDF
VSSOP8 Abstract: JEDEC MO-187 MO-187 VSSOP-8 SOT765-1 sot765 Text: PDF: 2002 Jun 07 Philips Semiconductors Package outline VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index A3 θ Lp 1 4 e L detail X w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)	Original	OT765-1 MO-187 VSSOP8 JEDEC MO-187 MO-187 VSSOP-8 SOT765-1 sot765	PDF
VSSOP8 Abstract: No abstract text available Text: P8 SO VS SOT765-1 VSSOP8; Reel pack, reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or H Ordering code 12NC ending 125 Rev. 5 — 3 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel	Original	OT765-1 001aak603 prod715 OT765-1 VSSOP8	PDF
SOT763-1 Abstract: nxp Tape and Reel Information SOT-763 Text: SOT763-1 Standard product orientation 12NC ending 115 Rev. 01 — 22 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT763-1 115	Original	OT763-1 OT763-1 SOT763-1 nxp Tape and Reel Information SOT-763	PDF
Untitled Abstract: No abstract text available Text: Package outline DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A E A1 c detail X terminal 1 index area terminal 1 index area C e1 e 2 6 y y1 C v M C A B	Original	DHVQFN14: OT762-1 MO-241	PDF

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SOT76 Search Results

SOT76 Price and Stock

Nexperia 74LVC2G08DC-Q100H

Nexperia 74LVC2G125DC,125

Nexperia 74LVC2T45DC,125

Nexperia 74AHC123ABQ,115

Nexperia 74HC4051BQ,115

SOT76 Datasheets (13)

SOT76 Datasheets Context Search

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2N2090

DBS27P

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HEF4052B-Q100

dhvqfn14

DHVQFN-20

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SOT762-1

SOT764-1

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HQFP128

DHVQFN16

B0278

SOT765-1

HLQFP176

VSSOP8

VSSOP8

SOT763-1

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