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    SOT766 Search Results

    SOT766 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT766-1 NXP Semiconductors Plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad Original PDF
    SOT766-2 NXP Semiconductors Plastic thermal enhanced low profile quad flat package; 176 leads Original PDF

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    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad SOT766-1 c y exposed die pad X Dh A 132 133 89 88 ZE e Eh E HE A A2 A1 A 3 θ wM Lp L bp detail X pin 1 index 176 45 1 44


    Original     		HLQFP176: OT766-1 MS-026 PDF

    HLQFP176

    Abstract: MS-026 sot766
    Text: PDF: 2002 Jun 13 Philips Semiconductors Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad SOT766-1 c y exposed die pad X Dh A 132 133 89 88 ZE e Eh E HE A A2 A1 A 3 θ wM Lp


    Original     		HLQFP176: OT766-1 MS-026 HLQFP176 MS-026 sot766 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4; exposed die pad SOT766-2 c y exposed die pad X Dh A 132 133 89 88 ZE e A3 A A2 θ A1 Eh E Lp detail X HE L w bp pin 1 index 176 44 1 v ZD w bp


    Original     		HLQFP176: OT766-2 MS-026 sot766-2 PDF