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    BGA324

    Abstract: BGA-324 MS-034 sot787
    Text: PDF: 2002 Oct 18 Philips Semiconductors Package outline BGA324: plastic ball grid array package; 324 balls; body 23 x 23 x 1.75 mm SOT787-1 B D A D1 ball A1 index area A A2 A 1 E1 E detail X C e1 e 1/2 ∅v M b e ∅w M AB AA Y W V U T R P N M L K J H G F


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    PDF BGA324: OT787-1 MS-034 BGA324 BGA-324 MS-034 sot787