DFC21R57P002HHA
Abstract: TRAY DIMENSIONS
Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING m u R n ta /n n crctfo r in F te cù w ics REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the
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DFC21R57P002HHA
TA2210
TypeTA2110:
178mm
TA2210:
330mm
TRAY DIMENSIONS
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DFC21R57P002HHA
Abstract: No abstract text available
Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING tn u ffn tn /kA cm tcr in Gec&m/& REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the
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OCR Scan
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PDF
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DFC21R57P002HHA
TA2210
TypeTA2110
178mm
TA2210:
330mm
CG01-H
DFC21R57P002HHA
|
DFC21R57P002HHA
Abstract: DFc21r57
Text: CERAMIC MICROWAVE FILTERS SOLDERING & PACKAGING REFLOW SOLDERING CONDITIONS The maximum temperature and time of soldering is shown in Figure 1. The soldering condition should be within the indicated line area. In case the soldering is repeated, the maximum time in Figure 1 should be accumulated time.
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OCR Scan
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PDF
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DFC21R57P002HHA
TA2210
TypeTA2110:
178mm
TA2210:
330mm
CG01-J
DFC21R57P002HHA
DFc21r57
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