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    "LEADFRAME MATERIAL" DIP 20 Search Results

    "LEADFRAME MATERIAL" DIP 20 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    C8231A Rochester Electronics LLC Math Coprocessor, 8-Bit, NMOS, CDIP24, DIP-24 Visit Rochester Electronics LLC Buy
    P8085AH-1 Rochester Electronics LLC Microprocessor, 8-Bit, 6MHz, NMOS, PDIP40, PLASTIC, DIP-40 Visit Rochester Electronics LLC Buy
    TCM3105NL Rochester Electronics LLC Modem, PDIP16, 0.300 INCH, PLASTIC, DIP-16 Visit Rochester Electronics LLC Buy
    P8085AH Rochester Electronics LLC Microprocessor, 8-Bit, 3MHz, NMOS, PDIP40, PLASTIC, DIP-40 Visit Rochester Electronics LLC Buy
    MD8085AH/B Rochester Electronics LLC Microprocessor, 8-Bit, 3MHz, HMOS, PDIP40, PLASTIC, DIP-40 Visit Rochester Electronics LLC Buy

    "LEADFRAME MATERIAL" DIP 20 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:


    Original     		063W/cm PDF

    leadframe

    Abstract: dip 28 thermal dip-28 DSA008820
    Text: Thermal Data  DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:


    Original     		063W/cm leadframe dip 28 thermal dip-28 DSA008820 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 18,20 18 leads 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 18,20 18 leads 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm PDF

    EPOXY RESIN

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C


    Original     		063W/cm 152x160 120x130 EPOXY RESIN PDF

    "leadframe material" DIP

    Abstract: "leadframe material" DIP 20
    Text: Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding :


    Original     		063W/cm "leadframe material" DIP "leadframe material" DIP 20 PDF

    heat sink

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 152x160 120x130 heat sink PDF

    dip 28 thermal

    Abstract: No abstract text available
    Text: Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm dip 28 thermal PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  DIP 18 18 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.6 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Typical assembly configuration before molding :


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data  DIP 18 18 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.6 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm 30ilver PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 152x160 120x130 PDF

    "leadframe material" DIP

    Abstract: dip 28 thermal
    Text: Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :


    Original     		063W/cm "leadframe material" DIP dip 28 thermal PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm PDF

    12THERMAL

    Abstract: No abstract text available
    Text: Thermal Data  DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 12THERMAL PDF

    "leadframe material" DIP 20

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm "leadframe material" DIP 20 PDF

    "leadframe material" DIP 20

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm "leadframe material" DIP 20 PDF

    a3020

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 152x160 120x130 a3020 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text:  Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 16 8+8 leads 8+8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 112x130 100x100 PDF

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		063W/cm 165x220 120x130 PDF