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Catalog Datasheet	MFG & Type	PDF	Document Tags
heat sink Abstract: No abstract text available Text: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	PDF	063W/cm 152x160 120x130 heat sink
EPOXY RESIN Abstract: No abstract text available Text: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C	Original	PDF	063W/cm 152x160 120x130 EPOXY RESIN
a3020 Abstract: No abstract text available Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	PDF	063W/cm 152x160 120x130 a3020
Untitled Abstract: No abstract text available Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C	Original	PDF	063W/cm 152x160 120x130