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    120X130 Search Results

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    120X130 Price and Stock

    Koyo Encoder Inc JR120X130X30

    NRB Solid Race Inner Ring, 120mm ID, 130mm OD, High Carbon Chrome Steel | Koyo JR120X130X30
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS JR120X130X30 Bulk 3 Weeks 1
    • 1 $208.95
    • 10 $202.53
    • 100 $202.53
    • 1000 $202.53
    • 10000 $202.53
    		Get Quote

    SKF IR 120X130X30

    NRB-NEEDLE ROLLER BEARING | SKF IR 120X130X30
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS IR 120X130X30 Bulk 3 Weeks 1
    • 1 $281.4
    • 10 $281.4
    • 100 $281.4
    • 1000 $281.4
    • 10000 $281.4
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    INA Bearings IR120X130X30-XL (ALTERNATE: 1946970)

    INNER RING 120MM X 130MM X 30MM | INA Bearings (Schaeffler) IR120X130X30-XL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS IR120X130X30-XL (ALTERNATE: 1946970) Bulk 1
    • 1 $250.79
    • 10 $238.25
    • 100 $213.17
    • 1000 $213.17
    • 10000 $213.17
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    Dichtomatik MA39-120X130X11.5 (ALTERNATE: 75189396)

    Oil Seal, 120mm ID, 130mm OD, 12.5mm Width | Dichtomatik MA39-120X130X11.5
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    RS MA39-120X130X11.5 (ALTERNATE: 75189396) Bulk 3 Weeks 27
    • 1 -
    • 10 -
    • 100 $14.11
    • 1000 $14.11
    • 10000 $14.11
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    Oring Uszczelnienia Techniczne Z120X130X5/7P

    Wiipers Z; PU; Øout: 130mm; -30÷100°C; Shore hardness: 92; single
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME Z120X130X5/7P 9 1
    • 1 $1.25
    • 10 $1.13
    • 100 $1
    • 1000 $1
    • 10000 $1
    		Buy Now
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    120X130 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    heat sink

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 24 20+2+2 leads 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach epoxy glue silver filled 15-50 µm 0.01 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		PDF 063W/cm 152x160 120x130 heat sink

    heat sink to220

    Abstract: TH17023
    Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder


    Original     		PDF O-220, 063W/cm O-220 120x130 TH17023 175x195 heat sink to220

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm


    Original     		PDF 063W/cm 149x135 120x130 112x130 100x100

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER SIP Family 9,10 leads 9 leads 10 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm


    Original     		PDF 063W/cm 149x135 120x130 112x130 100x100

    EPOXY RESIN

    Abstract: No abstract text available
    Text: Thermal Data  POWER DIP 24 20+2+2 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.6 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C


    Original     		PDF 063W/cm 152x160 120x130 EPOXY RESIN

    a3020

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		PDF 063W/cm 152x160 120x130 a3020

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder


    Original     		PDF O-220, 063W/cm O-220 120x130 TH17023 175x195

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 20 16+2+2 leads 16+2+2 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		PDF 063W/cm 152x160 120x130

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin


    Original     		PDF 063W/cm 120x130 175x195

    DIP18

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		PDF 063W/cm 165x220 120x130 DIP18

    NF800-CEP

    Abstract: NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi
    Text: MITSUBISHI ELECTRIC Low Voltage Switchgears Moulded-Case Circuit Breakers Disconnectors WSS, PSS & Super Series 3 A – 1600 A Technical Catalogue 2004 AUDIN - 8, avenue de la malle - 51370 Saint Brice Courcelles - Tel : 03.26.04.20.21 - Fax : 03.26.04.28.20 - Web : http: www.audin.fr - Email : [email protected]


    Original     		PDF RU-344041 ZA-1600 133207-D D-40880 NF800-CEP NF1250-SS DSN40 no-fuse Circuit breaker Mitsubishi

    Untitled

    Abstract: No abstract text available
    Text: ADVANCED COOLING METHODS FOR HIGH POWER DENSITY IN ELECTRONIC By Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY Director of European Business Development Via XXV Aprile 32 40057 Cadriano BO – ITALY Phone: +39 051 764011 Fax: +39 051 764090 e-mail: [email protected]


    Original     		PDF 300x180x15

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data POWER DIP 18 12+3+3 leads 12+3+3 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C


    Original     		PDF 063W/cm 165x220 120x130

    Untitled

    Abstract: No abstract text available
    Text: Thermal Data CLIPWATT Family 8,11,15 leads 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin


    Original     		PDF 063W/cm 120x130 175x195