W3E16M72S-XBX
Abstract: W3E32M72S-XBX
Text: White Electronic Designs W3E16M72S-XBX 16Mx72 DDR SDRAM FEATURES DDR SDRAM Rate = 200, 250, 266 Package: • 219 Plastic Ball Grid Array PBGA , 32 x 25mm BENEFITS 40% SPACE SAVINGS Reduced part count Reduced I/O count • 34% I/O Reduction 2.5V ±0.2V core power supply
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W3E16M72S-XBX
16Mx72
W3E16M72S-XBX
W3E32M72S-XBX
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WEDPN16M72V-XBX 16Mx72 Synchronous DRAM FEATURES The 128MByte 1Gb SDRAM is a high-speed CMOS, dynamic random-access, memory using 5 chips containing 268,435,456 bits. Each chip is internally configured as a quad-bank DRAM with a synchronous interface. Each of
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WEDPN16M72V-XBX
16Mx72
128MByte
864-bit
100MHz,
125MHz
100MHz
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Untitled
Abstract: No abstract text available
Text: WEDPN4M72V-XBX HI-RELIABILITY PRODUCT 4Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits. Each chip is internally configured as a quad-bank DRAM with a
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WEDPN4M72V-XBX
4Mx72
125MHz
WEDPN4M72V-XBX
32MByte
256Mb)
100MHz
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Untitled
Abstract: No abstract text available
Text: WEDPN8M72V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 64MByte 512Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 134,217,728 bits. Each chip is internally configured as a quad-bank DRAM with
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WEDPN8M72V-XBX
8Mx72
125MHz
WEDPN8M72V-XBX
64MByte
512Mb)
100MHz
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Untitled
Abstract: No abstract text available
Text: WEDPN16M72V-XBX HI-RELIABILITY PRODUCT 16Mx72 Synchronous DRAM *ADVANCED FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 128MByte 1Gb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 268,435,456 bits. Each chip is internally configured as a quad-bank DRAM with
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WEDPN16M72V-XBX
16Mx72
125MHz
128MByte
864-bit
100MHz
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WEDPN4M72V-XBX
Abstract: No abstract text available
Text: WEDPN4M72V-XBX 4Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION ! High Frequency = 100, 125MHz ! Package: The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits. Each chip is internally configured as a quadbank DRAM with a synchronous interface. Each of the chip’s
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WEDPN4M72V-XBX
4Mx72
125MHz
32MByte
256Mb)
216-bit
100MHz,
WEDPN4M72V-XBX
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Untitled
Abstract: No abstract text available
Text: PreLIMINARY Information L9D112G80BG4 1.2 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Laminate Ball Grid array (LBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply
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L9D112G80BG4
LDS-L9D112G80BG4-A
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WEDPN16M72V-XBX
Abstract: WEDPN8M72V-XBX 54TSOP WEDPN16M72-XBX
Text: 16M x 72 SDRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPN16M72V-XBX* Designed to complement PowerPCTM 750/755 and high performance memory controllers see other side for typical application block diagram Performance Features • SDRAM CAS Latency = 3 (125MHz), 2 (100MHz) or 3 (100MHz), 2 (75MHz)
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WEDPN16M72V-XBX*
125MHz)
100MHz)
75MHz)
WEDPN8M72V-XBX*
755sbd
WEDPN16M72-XBX
MIF2004
WEDPN16M72V-XBX
WEDPN8M72V-XBX
54TSOP
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WEDPN
Abstract: No abstract text available
Text: WEDPN4M72V-XBX HI-RELIABILITY PRODUCT 4Mx72 Synchronous DRAM PRELIMINARY* FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz* The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits.
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WEDPN4M72V-XBX
4Mx72
125MHz*
32MByte
256Mb)
216-bit
100MHz
125MHz
WEDPN
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Untitled
Abstract: No abstract text available
Text: WEDPN8M72V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM PRELIMINARY* FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 64MByte 512Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 134,217,728 bits. Each chip is internally configured as a quad-bank DRAM with
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WEDPN8M72V-XBX
8Mx72
125MHz
64MByte
512Mb)
432-bit
100MHz
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DQ75
Abstract: No abstract text available
Text: WEDPN4M72V-XBX HI-RELIABILITY PRODUCT 4Mx72 Synchronous DRAM PRELIMINARY* FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits.
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WEDPN4M72V-XBX
4Mx72
125MHz
32MByte
256Mb)
216-bit
100MHz
DQ75
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WEDPN8M72V-XBX 8Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION n High Frequency = 100, 125MHz n Package: • 219 Plastic Ball Grid Array PBGA , 32 x 25mm n Single 3.3V ±0.3V power supply n Fully Synchronous; all signals registered on positive
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8Mx72
125MHz
WEDPN8M72V-XBX
WEDPN8M72V-XBX
64MByte
512Mb)
100MHz
100MHz,
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Untitled
Abstract: No abstract text available
Text: WEDPND16M72S-XBX White Electronic Designs 16Mx72 DDR SDRAM Preliminary* FEATURES BENEFITS n High Frequency = 200, 250, 266MHz n 40% SPACE SAVINGS n Package: n Reduced part count n Reduced I/O count • 219 Plastic Ball Grid Array PBGA , 32 x 25mm n 2.5V ±0.2V core power supply
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16Mx72
266MHz
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WEDPN4M72V-XBX 4Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION n High Frequency = 100, 125MHz n Package: The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits. Each chip is internally configured as a quadbank DRAM with a synchronous interface. Each of the chip’s
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4Mx72
125MHz
WEDPN4M72V-XBX
WEDPN4M72V-XBX
32MByte
256Mb)
100MHz
100MHz,
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Untitled
Abstract: No abstract text available
Text: WEDPN8M72V-133BC 8Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 133MHz Single 3.3V ±0.3V power supply The 64MByte 512Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 134,217,728 bits. Each chip is internally configured as a quad-bank DRAM
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WEDPN8M72V-133BC
8Mx72
133MHz
WEDPN8M72V-133BC
64MByte
512Mb)
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WEDPN4M72V-XB2X PRELIMINARY 4Mx72 Synchronous DRAM GENERAL DESCRIPTION FEATURES High Frequency = 100, 125MHz Package: The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing
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4Mx72
125MHz
WEDPN16M64V-XB2X
WEDPN4M72V-XB2X
32MByte
256Mb)
100MHz
WEDPN4M72V
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W3E16M72S-XBX
Abstract: W3E32M72S-XBX
Text: W3E16M72S-XBX White Electronic Designs 16Mx72 DDR SDRAM FEATURES DDR SDRAM Rate = 200, 250, 266 Package: • 219 Plastic Ball Grid Array PBGA , 32 x 25mm BENEFITS 2.5V ±0.2V core power supply 2.5V I/O (SSTL_2 compatible)
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W3E16M72S-XBX
16Mx72
W3E16M72S-XBX
W3E32M72S-XBX
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AS4DDR16M72PBG
Abstract: AS4DDR32M72PBG W3E16M72S-XBX E1-E16
Text: i PEM 1.2 G b SDRAM-DDR Gb Austin Semiconductor, Inc. AS4DDR16M72PBG 16Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: 40% SPACE SAVINGS Reduced part count Reduced I/O count
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AS4DDR16M72PBG
16Mx72
333Mbps
M72-8/XT
AS4DDR16M72-10/XT
219-PBGA
AS4DDR16M72PBG
AS4DDR32M72PBG
W3E16M72S-XBX
E1-E16
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Diodes Incorporated 17-33
Abstract: CKE 2009 cke02 RING TERM M6 2,5mm2
Text: PreLIMINARY Information L9D125G80BG4 2.5 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Plastic Ball Grid array (PBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply
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L9D125G80BG4
LDS-L9D125G80BG4-C
Diodes Incorporated 17-33
CKE 2009
cke02
RING TERM M6 2,5mm2
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Untitled
Abstract: No abstract text available
Text: WEDPN4M72V-XBX HI-RELIABILITY PRODUCT 4Mx72 Synchronous DRAM PRELIMINARY* FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits.
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WEDPN4M72V-XBX
4Mx72
125MHz
32MByte
256Mb)
216-bit
100MHz
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PDF
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Untitled
Abstract: No abstract text available
Text: WEDPN8M72V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM PRELIMINARY* FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 64MByte 512Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits.
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WEDPN8M72V-XBX
8Mx72
125MHz
64MByte
512Mb)
432-bit
100MHz
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PDF
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WEDPN16M72V-XB2X
Abstract: No abstract text available
Text: White Electronic Designs WEDPN16M72V-XB2X 16Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125, 133MHz Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm Single 3.3V ±0.3V power supply Fully Synchronous; all signals registered on positive
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WEDPN16M72V-XB2X
16Mx72
133MHz
WEDPN16M72V-XB2X
128MByte
268anges
525mm2
133MHz
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WEDPN4M72V-XB2X
Abstract: WEDPN8M72V-XB2X
Text: White Electronic Designs WEDPN4M72V-XB2X 4Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125, 133MHz Package: The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits. Each chip is internally configured as a
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WEDPN4M72V-XB2X
4Mx72
133MHz
32MByte
256Mb)
216-bit
133MHz
WEDPN4M72V-XB2X
WEDPN8M72V-XB2X
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PDF
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AS4DDR16M72PBG
Abstract: AS4DDR32M72PBG W3E16M72S-XBX
Text: i PEM 1.2 G b SDRAM-DDR Gb Austin Semiconductor, Inc. AS4DDR16M72PBG 16Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: 40% SPACE SAVINGS Reduced part count Reduced I/O count
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AS4DDR16M72PBG
16Mx72
333Mbps
219-PBGA
AS4DDR16M72PBG
AS4DDR32M72PBG
W3E16M72S-XBX
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