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Raltron Electronics Corporation H130A-12.000-18-2030-EXT-TR CRYSTAL 12.0000MHZ 18PF SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	H130A-12.000-18-2030-EXT-TR	Digi-Reel	3,907		1	1 $0.53 10 $0.452 100 $0.3896 1000 $0.3514 10000 $0.3514	Buy Now
	H130A-12.000-18-2030-EXT-TR	Cut Tape	3,907		1	1 $0.53 10 $0.452 100 $0.3896 1000 $0.3514 10000 $0.3514	Buy Now
	H130A-12.000-18-2030-EXT-TR	Reel	2,000		1,000	1 - 10 - 100 - 1000 $0.28617 10000 $0.24716	Buy Now
Newark	H130A-12.000-18-2030-EXT-TR	Cut Tape	2,990		1	1 $0.599 10 $0.505 100 $0.412 1000 $0.412 10000 $0.412	Buy Now
Karl Kruse GmbH & Co KG	H130A-12.000-18-2030-EXT-TR		1,000			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Raltron Electronics Corporation H130A-12.000-8-TR CRYSTAL 12.0000MHZ 8PF SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	H130A-12.000-8-TR	Cut Tape	1,672		1	1 $0.55 10 $0.454 100 $0.3636 1000 $0.34542 10000 $0.34542	Buy Now
	H130A-12.000-8-TR	Digi-Reel	1,672		1	1 $0.55 10 $0.454 100 $0.3636 1000 $0.34542 10000 $0.34542	Buy Now
Karl Kruse GmbH & Co KG	H130A-12.000-8-TR		1,000			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Ozdisan Elektronik	H130A-12.000-8-TR					1 $0.35144 10 $0.35144 100 $0.35144 1000 $0.3056 10000 $0.3056	Get Quote
Mean Well DKA30A-12 DC DC CONVERTER +/-12V 30W
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DKA30A-12	Tube	368		1	1 $25.14 10 $25.14 100 $25.14 1000 $25.14 10000 $25.14	Buy Now
Avnet Americas	DKA30A-12	Box		19 Weeks, 3 Days	1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
TME	DKA30A-12		914		1	1 $37.3 10 $28.1 100 $24.5 1000 $24.5 10000 $24.5	Buy Now
Master Electronics	DKA30A-12		85			1 $31.78 10 $28.74 100 $28.17 1000 $28.17 10000 $28.17	Buy Now
Neutron USA	DKA30A-12		50			1 $59.99 10 $59.99 100 $59.99 1000 $59.99 10000 $59.99	Buy Now
SL Power Electronics TE30A1203B01 AC/DC WALL MOUNT ADAPTER 12V 30W
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	TE30A1203B01	Box	260		1	1 $23.43 10 $23.43 100 $20.8525 1000 $20.37388 10000 $20.37388	Buy Now
Master Electronics	TE30A1203B01		306			1 $27.29 10 $25.63 100 $22.02 1000 $21.15 10000 $21.15	Buy Now
Sager	TE30A1203B01		199		1	1 $20.36 10 $19.73 100 $18.9 1000 $18.9 10000 $18.9	Buy Now
TDK-Lambda Corporation HWS30A-12-A AC/DC CONVERTER 12V 30W
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	HWS30A-12-A	Bulk	231		1	1 $58.61 10 $56.43 100 $51.55 1000 $51.55 10000 $51.55	Buy Now

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30A12 Datasheets (8)

Part	Manufacturer	Description	Datasheet Type	PDF
30A12-N15-C	UltraVolt	IC CONV DC-DC SNGL OUT STEP UP 12VIN	Original	PDF
30A12-N15-E	UltraVolt	IC CONV DC-DC SNGL OUT STEP UP 12VIN	Original	PDF
30A12-N4-C	UltraVolt	IC CONV DC-DC SNGL OUT STEP UP 12VIN	Original	PDF
30A12-N4-E	UltraVolt	IC CONV DC-DC SNGL OUT STEP UP 12VIN	Original	PDF
30A12-P15-C	UltraVolt	IC CONV DC-DC SNGL OUT STEP UP 12VIN	Original	PDF
30A12-P15-E	UltraVolt	IC CONV DC-DC SNGL OUT STEP UP 12VIN	Original	PDF
30A12-P30-C	UltraVolt	IC CONV DC-DC SNGL OUT STEP UP 12VIN	Original	PDF
30A12-P4-E	UltraVolt	IC CONV DC-DC SNGL OUT STEP UP 12VIN	Original	PDF

30A12 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
DPS512X8MKN3 Abstract: No abstract text available Text: 512Kx8, 20 - 45ns, STACK/DIP 30A129-11 D 4 Megabit High Speed CMOS SRAM DPS512X8MKN3 PRELIMINARY DESCRIPTION: The DPS512X8MKN3 High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable	Original	PDF	512Kx8, 30A129-11 DPS512X8MKN3 DPS512X8MKN3 600-mil-wide, 32-pin
Untitled Abstract: No abstract text available Text: 2Mx16, 20 - 45ns, STACK 30A129-08 A 32 Megabit High Speed CMOS SRAM DPS2MX16MKn3 DESCRIPTION: The DPS2MX16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .	Original	PDF	2Mx16, 30A129-08 DPS2MX16MKn3 DPS2MX16MKn3 32-Megabits 500mV
DPS2MK32MKV3 Abstract: No abstract text available Text: 8Mx8/4Mx16/2Mx32, 20 - 45ns, PGA 30A128-18 A 64 Megabit High Speed CMOS SRAM DPS2MK32MKV3 PRELIMINARY DESCRIPTION: The DPS2MK32MKV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip	Original	PDF	8Mx8/4Mx16/2Mx32, 30A128-18 DPS2MK32MKV3 DPS2MK32MKV3 500mV
soj 36 Abstract: DPS512M8MKJ DPS512M8KH Text: 512Kx8, 20 - 45ns, STACK/DIP 30A129-11 D 4 Megabit High Speed CMOS SRAM DPS512M8MKH/DPS512M8MKJ DESCRIPTION: The DPS512M8MKH/DPS512M8MKJ are 4,194,304 bit High Speed Satic Random Access Memory monolithics organised as 524,288 words by 8 bits. The DPS512M8MKH/DPS512M8MKJ uses 8 common	Original	PDF	512Kx8, 30A129-11 DPS512M8MKH/DPS512M8MKJ DPS512M8MKH/DPS512M8MKJ 36-pin 30A197-00 soj 36 DPS512M8MKJ DPS512M8KH
DPS1MK32MKV3 Abstract: No abstract text available Text: 4Mx8/2Mx16/1Mx32, 20 - 45ns, PGA 30A128-14 B 32 Megabit High Speed CMOS SRAM DPS1MK32MKV3 DESCRIPTION: The DPS1MK32MKV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip	Original	PDF	4Mx8/2Mx16/1Mx32, 30A128-14 DPS1MK32MKV3 DPS1MK32MKV3 500mV
Untitled Abstract: No abstract text available Text: 4Mx8/2Mx16/1Mx32, 90 - 120ns, PGA 30A126-22 D 32 Megabit FLASH EEPROM DPZ1MH32NV3 DESCRIPTION: The DPZ1MH32NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers	Original	PDF	4Mx8/2Mx16/1Mx32, 120ns, 30A126-22 DPZ1MH32NV3 DPZ1MH32NV3
MID-30A12 Abstract: No abstract text available Text: T-1 PACKAGE PIN PHOTODIODE MID-30A12 Description Package Dimensions The MID-30A12 is a PIN photodiode mou- Unit : mm inches nted in a lensed , special dark plastic package.The lens- 3.00 (.118) ing effect of the package allows an acceptance half view angle of 10° that is measured from the optical axis to the	Original	PDF	MID-30A12 MID-30A12 40MIN. 00MIN. 940nm)
DPS512X32MKV3 Abstract: No abstract text available Text: 2Mx8/1Mx16/512Kx32, 20 - 45ns, PGA 30A128-02 C 16 Megabit High Speed CMOS SRAM DPS512X32MKV3 DESCRIPTION: The DPS512X32MKV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip	Original	PDF	2Mx8/1Mx16/512Kx32, 30A128-02 DPS512X32MKV3 DPS512X32MKV3 500mV
Untitled Abstract: No abstract text available Text: 4Mx8/2Mx16/1Mx8, 90 - 120ns, PGA 30A126-02 F 32 Megabit FLASH EEPROM DPZ1MX32NV3 DESCRIPTION: The DPZ1MX32NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32	Original	PDF	4Mx8/2Mx16/1Mx8, 120ns, 30A126-02 DPZ1MX32NV3 DPZ1MX32NV3
Untitled Abstract: No abstract text available Text: 4Mx16/2Mx32, 90 - 120ns, PGA 30A126-14 A 64 Megabit FLASH EEPROM DPZ2MW32NV3 DESCRIPTION: The DPZ2MW32NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers	Original	PDF	4Mx16/2Mx32, 120ns, 30A126-14 DPZ2MW32NV3 DPZ2MW32NV3
Untitled Abstract: No abstract text available Text: 1Mx8, 20 - 45ns, STACK/DIP 30A129-12 B 8 Megabit High Speed CMOS SRAM DPS1MX8MKN3 DESCRIPTION: The DPS1MX8MKN3 High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired	Original	PDF	30A129-12 600-mil-wide, 32-pin
30A12 Abstract: No abstract text available Text: 2Mx16, 20 - 45ns, STACK 30A129-28 B 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 DESCRIPTION: The DPS2ME16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .	Original	PDF	2Mx16, 30A129-28 DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV 30A12
30A120CT Abstract: SBR30A120 SBR30A120CT Text: 30A120CT 30A120CTFP 30A SBR Super Barrier Rectifier NEW PRODUCT Features • • • • • • • Mechanical Data • Low Forward Voltage Drop Excellent High Temperature Stability Patented Super Barrier Rectifier Technology Soft, Fast Switching Capability	Original	PDF	SBR30A120CT SBR30A120CTFP O-220AB, ITO-220AB J-STD-020C MIL-STD-202, SBR30A120 30A120CT SBR30A120CT
MC68EC030FE40C Abstract: MC68EC030CFE25C F91C MC68EC030FE25CB1 MC68EC030 section 5 MC68030FE33C MC68EC030FE25C sfc 2812 MC68030CRC 68EC030 Text: MOTOROLA Order this document by MC68EC030/D SEMICONDUCTOR TECHNICAL DATA MC68EC030 Technical Summary Second-Generation 32-Bit Enhanced Embedded Controller The MC68EC030 is a 32-bit embedded controller that streamlines the functionality of an MC68030 for the requirements of embedded control applications. The MC68EC030 is optimized to maintain	Original	PDF	MC68EC030/D MC68EC030 32-Bit MC68EC030 MC68030 MC68020, MC68030, MC68040 MC68EC030FE40C MC68EC030CFE25C F91C MC68EC030FE25CB1 MC68EC030 section 5 MC68030FE33C MC68EC030FE25C sfc 2812 MC68030CRC 68EC030

UA145 Abstract: No abstract text available Text: 8 Megabit High Speed CMOS SRAM DPS1MX8MKN3-A DESCRIPTION: The DPS1MX8MKN3-A High Speed SRAM ‘’STACK’’ devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate having side-brazed	Original	PDF	600-mil-wide, 32-pin 30A129-92 UA145
30A120CT Abstract: marking code L2 marking L2 B2 marking code case MARKING A1 diode Marking code A2 marking CODE a2 MARKING CODE H1 MARKING CODE L1 marking H1 Text: 30A120CT 30A120CTFP 30A SBR SUPER BARRIER RECTIFIER NEW PRODUCT Features • • • • • • Mechanical Data • • Low Forward Voltage Drop Excellent High Temperature Stability Patented Super Barrier Rectifier Technology Soft, Fast Switching Capability	Original	PDF	SBR30A120CT SBR30A120CTFP O-220AB O-220AB, ITO-220AB J-STD-020D MIL-STD-202, SBR30A120 DS31094 30A120CT marking code L2 marking L2 B2 marking code case MARKING A1 diode Marking code A2 marking CODE a2 MARKING CODE H1 MARKING CODE L1 marking H1
sfc 2812 Abstract: M68000 MC68010 MC68020 MC68030 MC68040 MC68EC030 MC88916 mc68ec030rp Text: Freescale Semiconductor, Inc. Order this document by MC68EC030/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA MC68EC030 Freescale Semiconductor, Inc. Technical Summary Second-Generation 32-Bit Enhanced Embedded Controller The MC68EC030 is a 32-bit embedded controller that streamlines the functionality of an MC68030 for	Original	PDF	MC68EC030/D MC68EC030 32-Bit MC68EC030 MC68030 MC68020, MC68030, MC68040 sfc 2812 M68000 MC68010 MC68020 MC88916 mc68ec030rp
AL437 Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two	Original	PDF	8b/10b OIF-SPI4-02 ORSPI4-1FE1036IES ORSPI4-F1156IES ORSPI4-2FE1036CES ORSPI4-1FE1036CES ORSPI4-2F1156CES ORSPI4-1F1156CES AL437 L97c L235C L103T L41C L140C L94C l165c L239C L43C
3UA12 Abstract: No abstract text available Text: DENSE-PAC 64 Megabit FLASH EEPROM DPZ2MW32NV3 M I C R O S Y S T E M S DESCRIPTION: The D P Z 2 M W 3 2 N V 3 "V E R S A -S T A C K " m o d u le is a re v o lu tio n a ry new m e m ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C h ip Carriers	OCR Scan	PDF	DPZ2MW32NV3 120ns A126-14 3UA12
Untitled Abstract: No abstract text available Text: PA C 8 Megabit High Speed CM OS SRAM M i € R Ù S Y 'S-1 E M S DPS1MX8MKN3 DESCRIPTION: The DPS1.MX8MKN3 High Speed SRAM "STACK" devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ mounted on a co-fired	OCR Scan	PDF	600-mil-wide, 32-pin
Untitled Abstract: No abstract text available Text: 32 Megabit High Speed CMOS SRAM D E N S E -P A C DPS2MX16MKn3 Mí C RO SYSTEMS DESCRIPTION: The DPS2MX16MKn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Lead less Chip Carriers SLCC .	OCR Scan	PDF	DPS2MX16MKn3 DPS2MX16MKn3 32-Megabits 500mV 30A129-08
Untitled Abstract: No abstract text available Text: DENSE-PAC M I C R O S Y S T E M 128 Megabit FLASH EEPROM S D P Z 8M X 16N V 3 DESCRIPTION: T h e D P Z 8 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a re v o lu tio n a ry n e w m e m o ry su b system u sin g D en se-Pac M ic ro sy ste m s' c e ra m ic S tackab le Le ad le ss C h ip C a rrie rs	OCR Scan	PDF	100ns 120ns 150ns 125-C 30A123-06
Untitled Abstract: No abstract text available Text: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS51 2X 3 2 M KV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The D PS512X32M KV 3 "V ER SA -S TA C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip	OCR Scan	PDF	PS512X32M DPS512X32MKV3 surfa85 3QA128-02
Untitled Abstract: No abstract text available Text: _ DENSE-PAC ñ n J 1' 32 Megabit FLASH EEPROM DPZ2MX16NV3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: T h e D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a	OCR Scan	PDF	DPZ2MX16NV3 30A123-00 120ns

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30A12 Search Results

30A12 Price and Stock

Raltron Electronics Corporation H130A-12.000-18-2030-EXT-TR

Raltron Electronics Corporation H130A-12.000-8-TR

Mean Well DKA30A-12

SL Power Electronics TE30A1203B01

TDK-Lambda Corporation HWS30A-12-A

30A12 Datasheets (8)

30A12 Datasheets Context Search

DPS512X8MKN3

Untitled

DPS2MK32MKV3

soj 36

DPS1MK32MKV3

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MID-30A12

DPS512X32MKV3

Untitled

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30A12

30A120CT

MC68EC030FE40C

UA145

30A120CT

sfc 2812

AL437

3UA12

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