DPS2ME16MKN3 Search Results

DPS2ME16MKN3 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
DPS2ME16MKN3		DPAC Technologies	2mx16 High Speed CMOS SRAM		Original	PDF

DPS2ME16MKN3 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
30A12 Abstract: No abstract text available Text: 2Mx16, 20 - 45ns, STACK 30A129-28 B 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 DESCRIPTION: The DPS2ME16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .	Original	PDF	2Mx16, 30A129-28 DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV 30A12
Untitled Abstract: No abstract text available Text: DENSE-PAC 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 MICROSYSTEMS D ESCRIPTIO N : The DPS2ME16MKn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded	OCR Scan	PDF	DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV
1431 T Abstract: No abstract text available Text: DENSE-PAC 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 MICROSYSTEMS DESCRIPTION: The DPS2ME16MKn3 High Speed SRAM "STACK” modules are a re vo lu tio n a ry new m em ory su b syste m using D ense-P ac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .	OCR Scan	PDF	DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV 30A129-28 1431 T

Catalog Datasheet

MFG & Type

PDF

Document Tags

30A12

Abstract: No abstract text available
Text: 2Mx16, 20 - 45ns, STACK 30A129-28 B 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 DESCRIPTION: The DPS2ME16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

Original

PDF

2Mx16, 30A129-28 DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV 30A12

Untitled

Abstract: No abstract text available
Text: DENSE-PAC 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 MICROSYSTEMS D ESCRIPTIO N : The DPS2ME16MKn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded

OCR Scan

PDF

DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV

1431 T

Abstract: No abstract text available
Text: DENSE-PAC 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 MICROSYSTEMS DESCRIPTION: The DPS2ME16MKn3 High Speed SRAM "STACK” modules are a re vo lu tio n a ry new m em ory su b syste m using D ense-P ac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .