Untitled
Abstract: No abstract text available
Text: Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 SOT263B E p1 A ∅p A1 q D1 mounting base D L1 Q L2 m L 1 5 e b c w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 b c D D1 E e L mm 4.5 4.1
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Original
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O-220
OT263B
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PDF
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Untitled
Abstract: No abstract text available
Text: 1-1-3 Multi-Output Type Regulator IC SI-3000KWD Series 2-Output, Surface-Mount, Low Dropout Voltage Linear Regulator IC •Features ■Absolute Maximum Ratings Ta=25°C • Surface-mount package (SOT263-5) Ratings Parameter • Output current: 1.0A x 2
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Original
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SI-3000KWD
OT263-5)
SI-3002KWD/SI-3003KWD
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PDF
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TO-220 JEDEC
Abstract: sot263b 16l22
Text: PDF: 2001 Jan 11 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 SOT263B E p1 A ∅p A1 q D1 mounting base D L1 Q L2 m L 1 5 e b c w M 5 10 mm scale DIMENSIONS mm are the original dimensions
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Original
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O-220
OT263B
TO-220 JEDEC
sot263b
16l22
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option SOT263B-01 E p1 A ∅p A1 q D1 mounting base D L3 L L1 R L4 m 1 L2 5 e b R w M c Q Q1 Q2 5 10 mm scale DIMENSIONS mm are the original dimensions
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Original
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O-220
OT263B-01
O-220
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PDF
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SOT426
Abstract: SOT-263 SOT263 Philips Semiconductors Selection Guide High side switch
Text: Philips Semiconductors TOPFET High side switch Selection Guide VDS RDS ON @ID ID PD (V) (Ω) (A) (A) (W) TYPE NUMBER TECHNOLOGY ENVELOPE 1 50 0.038 10 20 125 BUK202-50X TOPFET High side switch SOT263-01 50 0.038 10 20 125 BUK202-50Y TOPFET High side switch
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Original
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BUK202-50X
BUK202-50Y
BUK206-50X
BUK206-50Y
BUK201-50X
BUK201-50Y
BUK205-50X
BUK205-50Y
BUK200-50X
BUK200-50Y
SOT426
SOT-263
SOT263
Philips Semiconductors Selection Guide
High side switch
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PDF
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SOT263
Abstract: SOT-263 sot263-01 TO-220 JEDEC
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option SOT263-01 E A A1 P q D1 mounting base D L4 L3 L1 R L L5 m 1 L2 5 e b w M R c Q Q1 Q2 5 10 mm scale DIMENSIONS mm are the original dimensions
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Original
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O-220
OT263-01
O-220
SOT263
SOT-263
sot263-01
TO-220 JEDEC
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 E SOT263 A A1 p q D1 mounting base D L1 Q L2 m L 1 5 e b c w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 b c D D1 E e L mm 4.5 4.1 1.39
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Original
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O-220
OT263
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PDF
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SOT263
Abstract: SOT-263
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 moumting hole; 5-lead TO-220 E SOT263 A A1 P q D1 mounting base D L1 L3 Q L2 m L 1 5 e b c w M 5 10 mm scale DIMENSIONS mm are the original dimensions
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Original
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O-220
OT263
SOT263
SOT-263
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PDF
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BUK108-50DL
Abstract: TOPFET SOT-263 Philips Semiconductors Selection Guide SOT404 BUK100 buk106
Text: Philips Semiconductors TOPFET Low side switch Selection Guide VDS RDS ON @ID ID PD (V) (Ω) (A) (A) (W) TYPE NUMBER TECHNOLOGY ENVELOPE 50 0.028 25 50 125 BUK106-50L TOPFET SOT263 50 0.028 25 50 125 BUK106-50LP TOPFET SOT263-01 50 0.028 25 50 125 BUK116-50L
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Original
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OT263
OT263-01
OT426
O220AB
OT404
BUK108-50DL
TOPFET
SOT-263
Philips Semiconductors Selection Guide
SOT404
BUK100
buk106
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option SOT263-01 E A A1 p q D1 mounting base D L3 L L1 R L4 m 1 L2 5 e b R w M c Q Q1 Q2 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT
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Original
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O-220
OT263-01
O-220
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PDF
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qfp 32 land pattern
Abstract: SSOP16 SSOP24
Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements
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Original
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OT186A;
OT263;
220AB
components24
MLC747
SSOP16
OT338-1)
SSOP24
OT340-1)
qfp 32 land pattern
SSOP16
SSOP24
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PDF
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L3 Package
Abstract: SOT263 TO-220 JEDEC sot263b
Text: PDF: 2001 Jan 11 Philips Semiconductors Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option SOT263B-01 E p1 A ∅p A1 q D1 mounting base D L3 L1 R L L4 m 1 L2 5 e b R w M c Q Q1 Q2 5 10 mm scale DIMENSIONS mm are the original dimensions
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Original
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O-220
OT263B-01
O-220
L3 Package
SOT263
TO-220 JEDEC
sot263b
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PDF
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BUK9907-55ATE
Abstract: No abstract text available
Text: BUK9907-55ATE N-channel TrenchPLUS logic level FET Rev. 02 — 16 February 2009 Product data sheet 1. Product profile 1.1 General description Logic level N-channel enhancement mode Field-Effect Transistor FET in a plastic package using TrenchMOS technology. The devices include TrenchPLUS diodes for
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Original
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BUK9907-55ATE
BUK9907-55ATE
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PDF
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BUK7907-55AIE
Abstract: No abstract text available
Text: BUK7907-55AIE N-channel TrenchPLUS standard level FET Rev. 02 — 9 February 2009 Product data sheet 1. Product profile 1.1 General description Standard level N-channel enhancement mode Field-Effect Transistor FET in a plastic package using TrenchMOS technology. The devices include TrenchPLUS current sensing
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Original
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BUK7907-55AIE
BUK7907-55AIE
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PDF
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|
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T0-220AB
Abstract: SOT-263
Text: MOUNTING INSTRUCTIONS Page SOT223 1140 SOT186; SOT263; T0220AB 1152
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OCR Scan
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OT223
OT186;
OT263;
T0220AB
T0-220AB
SOT-263
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PDF
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T0-220AB
Abstract: SOT-263
Text: MECHANICAL DATA page SOT93 618 SOT 186 619 T0220AB 620 SOT223 621 SOT227B 622 SOT263 623 SOT263 lead form option 624
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OCR Scan
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T0220AB
OT223
OT227B
OT263
T0-220AB
SOT-263
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PDF
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sot89 stencil
Abstract: No abstract text available
Text: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION 1898 LEADED DEVICES Handling Soldering 1898 GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements
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OCR Scan
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OT186A;
OT263;
220AB
T0220
SSOP16
SSOP24
OT338-1
OT34Q-1
sot89 stencil
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PDF
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T0-220AB
Abstract: SOT-263
Text: PACKAGE OUTLINES Page SOT186 1126 SOT186A 1127 SOT223 1128 SOT263 1129 SOT263-01 1130 SOT404 1131 SOT426 1132 T0220AB 1133
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OCR Scan
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OT186
OT186A
OT223
OT263
OT263-01
OT404
OT426
T0220AB
T0-220AB
SOT-263
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PDF
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T0-220AB
Abstract: SOT-263
Text: MOUNTING INSTRUCTIONS page SOT93 626 SOT186; SOT263; T0220AB 633 SOT227B ISOTOP 639 SOT223 642
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OCR Scan
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OT186;
OT263;
T0220AB
OT227B
OT223
T0-220AB
SOT-263
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PDF
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BUK444-200
Abstract: 100a mosfet Philips Semiconductors Selection Guide BUK454-60H BUK108-50DL BUK102-50GL BUk2 BUK44 BUK9630-55 BUK9570-55
Text: Philips Semiconductors TOPFETs Selection Guide VDs Rdsion lD Id V) (fl) (A) (A) Pd (W) TYPE NUMBER TECHNOLOGY ENVELOPE 50 0.028 25 50 125 BUK106-50L TOPFET 50 0.028 25 50 125 BUK106-50LP TOPFET SOT263-O1 50 0.028 25 50 125 BUK116-50L TOPFET SOT426 50
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OCR Scan
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7-800B
BUK446-800B
BUK454-800A
BUK444-800A
BUK454-800B
BUK444-800B
BUK456-1OOOB
BUK446-1000B
T0220AB
OT186
BUK444-200
100a mosfet
Philips Semiconductors Selection Guide
BUK454-60H
BUK108-50DL
BUK102-50GL
BUk2
BUK44
BUK9630-55
BUK9570-55
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PDF
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56359B
Abstract: No abstract text available
Text: MOUNTING INSTRUCTIONS Page SOT223 1140 SOT186; SOT263; T0220AB 1152 Philips Semiconductors Mounting instructions SOT223 TAPE and REEL PACKING SOT223 Tape and reel packing meets the feed requirements of automatic pick and place equipment (packing conforms
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OCR Scan
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OT223
OT186;
OT263;
T0220AB
OT223
OT223)
56359B
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PDF
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IGBTs Transistors
Abstract: No abstract text available
Text: PACKAGE OUTLINES Page SOT186 1126 SOT186A 1127 SOT223 1128 SOT263 1129 SOT263-01 1130 SOT404 1131 SOT426 1132 T0220AB 1133 Philips Semiconductors PowerMOS Transistors including TOPFETs and IGBTs Dimensions in mm _ , Package outlines 9 10.2 max 5.7 max N et Mass: 2 g
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OCR Scan
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OT186
OT186A
OT223
OT263
OT263-01
OT404
OT426
T0220AB
OT186;
IGBTs Transistors
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PDF
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BUK417-500B
Abstract: TOPFETs FETs T0-220AB mosfet BUK454-600 BUK617-500BE BUK551-100A PHILIPS MOSFET igbt Philips Semiconductors Selection Guide Igbts guide
Text: Philips Semiconductors PowerMOS Transistors including TO P FETs and IGBTs V DS V @ ID (A) Rdsjon) (ß) Id w Selection Guide Pd (W) TYPE NUMBER TECH NO LO GY ENVELOPE SOT263 50 0.028 25 50 125 BUK106-50L TOPFET 50 0.028 25 50 125 BUK106-50S TOPFET SOT263
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OCR Scan
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T0220AB
OT186
OT186
BUK856-400IZ
BUK417-500B
TOPFETs FETs
T0-220AB
mosfet
BUK454-600
BUK617-500BE
BUK551-100A
PHILIPS MOSFET igbt
Philips Semiconductors Selection Guide
Igbts guide
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PDF
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BUK10B-50US
Abstract: philips ldh d6506 BUK106-50L BUK106-50S buk106
Text: bSE » PHILIPS INTERNATIONAL • 7110fl2b D0b3flbS 2TM BiPHIN Product Specification Philips Semiconductors PowerMOS transìstor Logic level TOPFET_ DESCRIPTION Monolithic temperature and overload protected logic level power MOSFET in a 5 pin plastic
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OCR Scan
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7110fl2b
BUK106-50L7S
BUK106-50LP/SP
BUK106-50L/S
BUK106-50I7S
BUK10B-50US
philips ldh
d6506
BUK106-50L
BUK106-50S
buk106
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PDF
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